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| 0.35 mm-thick device enables backlighting for ultra-thin, feature-rich
mobile phones and PDAs | | | |
Agilent Technologies Inc. introduced the industry's thinnest
top-firing tricolor surface-mount LED (light-emitting diode), intended primarily for backlighting and status
indicators in ultra-thin, feature-rich mobile phones and PDAs. The new top-firing LED, in addition to Agilent's
recently announced side-firing LEDs, permits handset and PDA designers to mix separate red, green and blue light
sources in any combination.
In handsets and other handheld devices, separate colors can indicate incoming SMS
(short messaging system) messages, e-mail and stock news. They can even identify different callers. The availability
of an unlimited range of illumination colors also provides a new degree of design flexibility in many other
applications, such as backlighting and status indication in office and industrial equipment and home appliances.
"Our new 0.35 mm-thick, top-firing tricolor LED is the first of its kind to include a red, green and
blue die in such a small package," said Cheng Kai Chong, worldwide marketing manager for the Optoelectronic Products
Division in Agilent's Semiconductor Products Group. "Our latest device is enabling the next generation of
ultra-thin portable products with multiple backlighting color options. As an LED leader, we're committed to
supporting our customers' illumination and backlighting applications with the broadest line of quality products in
the high volumes required."
The Agilent HSMF-C114 tricolor chip-type LED features a four-terminal
common anode connection and is housed in Agilent's miniature 1.6 mm (L) x 1.5 mm (W) x 0.35 mm (H) package.
Precision manufacturing techniques ensure perfect pick-up by automated manufacturing equipment.
The HSMF-C114 combines InGaN (indium gallium nitride) blue (470 nm dominant wavelength, 70 mcd typical
brightness at 20 mA operating current); InGaN green, (525 nm dominant wavelength, 180-mcd typical brightness); and
AlInGaP (aluminum indium gallium phosphide) red (626 nm, 85 mcd) die. The LED features diffused optics, is
compatible with IR (infrared) reflow soldering processes, and is certified lead-free. Agilent's ChipLED package
features high thermal dissipation capability for maximum reliability. |
Jueves, 21 Julio, 2005 - 06:07 | |
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| 0.35 mm-thick device enables backlighting for ultra-thin, feature-rich
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¿Por qué esta magnífica tecnología científica, que ahorra trabajo y nos hace la vida más fácil, nos aporta tan poca felicidad? La repuesta es esta, simplemente: porque aún no hemos aprendido a usarla con tino.
Albert Einstein (1879-1955).
Físico estadounidense de origen alemán. |
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