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| Spansion Introduces Innovative Package-On-Package Solution To Reduce
Wireless Device Size | | | |
Sunnyvale, Calif. - Spansion LLC, the Flash memory venture of AMD and
Fujitsu Limited announced it is shipping Package-on-Package (PoP) Flash memory samples to customers that will enable
them to deliver sleek, feature-rich wireless phones, PDAs, digital cameras and MP3 players. Spansion’s new PoP
solution vertically combines discrete logic and memory packages for board space savings, lower pin-count, simplified
system integration and enhanced performance. As a result, handset manufacturers can accommodate the growing demand
for advanced features in their wireless products without having to increase their size and weight.
Spansion:
Driving PoP Standards, Chipset Support
Spansion takes a system-level approach to the design and delivery of
Flash memory and is undertaking extensive work to foster PoP standardization. As an active member of JEDEC, Spansion
leads the JC11.2 task group responsible for the PoP design guide generation. The company is also working to help
ensure broad availability and interoperability of its PoP solutions through close working relationships with chipset
vendors.
"Spansion's vision for an efficient and scaleable interface architecture has been
integral in driving JEDEC interface standards for package on package," said Lee Smith senior director of business
development for Amkor Technology, Inc. "We are now seeing tremendous interest from our customer base in combining
Amkor's award winning PSvfBGA bottom logic package with Spansion's top memory package. We are seeing immediate
benefits from this collaboration, and have extended our relationship with Spansion to include PoP roadmap alignment,
joint stacking and board-level reliability studies, which promise to facilitate PoP adoption in a broader range of
applications."
Technical Features
Spansion has the capability of delivering 8-die
solutions in a 128-ball, 12 x 12 mm package with a 0.65 mm pitch. PoP’s short trace lengths and low bus capacitance
also help to overcome the signal integrity and timing issues associated with emerging 133 MHz dual-data rate (DDR)
memory solutions. Spansion’s approach reduces pin-count and eliminates printed-circuit board (PCB) routing between
logic and memory, for reduced design complexity.
Spansion’s PoP solutions include the inherent
benefits of its advanced two-bit-per-cell MirrorBit™ technology, including the right combination of reliability,
cost, performance and density. With the future availability of the ORNAND™ architecture, Spansion plans to extend
the benefits of MirrorBit technology and believes it will be able to respond to the demand for mass storage
solutions in wireless handsets and complement application processors with an optimized code and data storage
solution.
Availability
Samples of 12 x 12 mm and 15 x 15 mm Flash memory PoP solutions
are available now for wireless phones and will vary in pricing depending on logic/memory densities and combinations.
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Lunes, 12 Septiembre, 2005 - 09:33 | |
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| Spansion Introduces Innovative Package-On-Package Solution To Reduce
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