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AMI Semiconductor Named a Top Preferred Supplier for 2006 by Rockwell Collins
Pocatello, Idaho - AMI Semiconductor (NASDAQ: AMIS), a designer and manufacturer of state-of-the-art integrated mixed-signal and structured digital products, was named a Top Preferred Supplier for 2006 by Rockwell Collins. The award was presented, during the company’s Annual Supplier Conference.
Leer la noticia completa Martes, 06 Junio, 2006 - 11:06

VIA Launches New Initiative to Drive Connected Client Computing in the Enterprise
Taipei, Taiwan - VIA Technologies, Inc, a leading innovator and developer of silicon chip technologies and PC platform solutions, today announced the VIA Connected Client Initiative designed to educate enterprise on connected client computing as a practical, cost effective solution to global I.T. management challenges; this will also be the focus of a dedicated technology track at this year's VTF, taking place in Taipei on Thursday 8th June.
Leer la noticia completa Martes, 06 Junio, 2006 - 11:05

Rockwell Automation Announces Turbine Supervisory Instrumentation Solution
MILWAUKEE — Drawing from more than 50 years of experience in machinery protection and condition monitoring, Rockwell Automation fulfills the requirements of Turbine Supervisory Instrumentation (TSI) with the addition of the new Allen-Bradley XM 121A Absolute Shaft and the XM 442 Voted Electronic Overspeed Detection System (EODS) Relay Modules.
Leer la noticia completa Martes, 06 Junio, 2006 - 11:03

 
Teridian Launches New High Performance Embedded Ethernet Controller
Irvine, Calif. - Teridian Semiconductor Corp. announced today sample availability of a high performance Fast Ethernet Controller for embedded applications. The 78Q8430 targets consumer electronics and industrial applications that require high performance, and ease of use, while limiting the burden on the host processor.
Leer la noticia completa Martes, 06 Junio, 2006 - 11:00

Intersil's New Triple-Channel Video Analog Front End IC Delivers High Bandwidth, Low Jitter and Ideal Black Levels
 
MILPITAS, CA – Intersil Corporation (NASDAQ: ISIL), a world leader in the design and manufacture of high-performance analog solutions, today introduced a new triple-channel analog front end (AFE) device that delivers optimal performance for televisions, monitors, home theater and business projectors.
Leer la noticia completa Viernes, 02 Junio, 2006 - 02:41

 
Kaga Toshiba to Build New 200mm Wafer-based Production Fab
 
TOKYO -Toshiba Corporation and Kaga Toshiba Electronics Corporation (Kaga Toshiba) today announced that they would construct a new semiconductor production fab based on 200mm wafers at Kaga Toshiba, a consolidated subsidiary of Toshiba based in Ishikawa prefecture, Japan. The new fab will enhance production capacity for power devices.
Leer la noticia completa Viernes, 02 Junio, 2006 - 02:38

CSR to provide BlueCore Silicon for Motorola iRadio® wireless audio car adapter
 
Cambridge, UK – CSR plc (LSE: CSR.L) today announced that the company will provide BlueCore3-Multimedia (BlueCore3-MM) silicon to Motorola for use in the company’s RCKT-100 wireless audio car adapter and handsfree unit. The BlueCore3-MM will provide the RCKT-100 with the ability to stream digital audio from a Motorola iRadio®-enabled phone to a compatible car stereo via a stereo Bluetooth link.
Leer la noticia completa Viernes, 02 Junio, 2006 - 02:34

 
VIA Launches Ultra Low Power VIA EPIA CN Mini-ITX Mainboard
Taipei, Taiwan - VIA Technologies, Inc, a leading innovator and developer of silicon chip technologies and PC platform solutions, today announced the VIA EPIA CN-Series Mini-ITX mainboards, the latest in the range of VIA C7 processor-based ultra compact platforms boasting an average power consumption of just 16 watts.
Leer la noticia completa Viernes, 02 Junio, 2006 - 02:30

UMC Announces Readiness for 65-nanometer X Architecture Designs
Taiwan and SAN JOSE, Calif - UMC (NYSE: UMC, TSE:2303), a leading global semiconductor foundry, and Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced the readiness of UMC's 65nm process technology for X Architecture-based chip designs. Cadence and UMC have successfully qualified 65nm X Architecture design rules, the Cadence X Architecture, and Design Support Manual (DSM) documents, allowing fabless and IDM companies to leverage the cost and performance benefits of the X Architecture for their leading system-on-chip (SoC) designs. The two companies are engaging with mutual customers towards X Architecture production designs at leading process nodes.
Leer la noticia completa Viernes, 02 Junio, 2006 - 02:27

 
Liquid-Cooled AC Drive From Rockwell Automation Features Compact Size and Expanded Application Flexibility
MILWAUKEE — Manufacturers and industrial motor users requiring a high-horsepower drive with a space-saving design can take advantage of the new Allen Bradley PowerFlex 700L liquid-cooled drive from Rockwell Automation. Featuring the ability to withstand increasingly rugged environments, motor control users in a variety of industries will benefit from the drive's high-performance, energy-efficient liquid-cooled technology.
Leer la noticia completa Viernes, 02 Junio, 2006 - 02:26

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