|Alguien dijo ...|
|Los hechos no dejan de existir solo porque sean ignorados,|
Thomas Henry Huxley(1825-1895).
Naturalista evolucionista inglés
|NEW NETOPIA MIAVO TRIPLE-PLAY GATEWAYS LEVERAGE ANALOG DEVICES’
Norwood - Analog Devices, Inc. and Netopia, Inc. today announced that
Netopia has adopted ADI’s Fusiv™ network processor and new ADSL2+ bonding reference platform as a foundation for
Netopia’s MiAVo bonded ADSL2+ gateways.
ADI’s design win is part of the growing adoption of ADSL2+ bonding
solutions among carriers and service providers. “Driving faster speeds to the customer is important, but in addition
to performance, cost matters for mass-market rollouts. The way that ADSL2+ bonding increases bandwidth while fitting
with carriers’ existing copper access connections is what makes it interesting,” said Sam Lucero, industry analyst
for Networking at In-Stat.
Netopia’s recently announced MiAVo family of triple-play gateways
feature high performance wide area network (WAN) interfaces with innovative new local area network (LAN)
distribution technologies for the delivery of triple-play services across fiber, VDSL, and bonded ADSL2+ networks.
The new Netopia family of bonded ADSL2+ gateways is ideal for carriers and service providers seeking to deliver
triple-play services across their upgraded ADSL2+ bonded networks.
Analog Devices’ ADSL2+ bonding
reference design, which includes its high-performance Fusiv and EaglePlus™ technologies, is compliant with the
recent ITU-T G.998.1 (G.bond-ATM) bonding standard. ADSL2+ loop bonding allows carriers to combine two or more
existing copper phone lines into a single connection that delivers high-bandwidth access. Carriers and service
providers gain the advantage of a quick, low-cost way to reach more subscribers with advanced broadband services
such as VoIP, IP television (IPTV), and triple-play bundles of voice, data, and video. The flexibility of ADI’s
Fusiv network processing technology enables optimal performance and bill-of-materials (BOM) cost for bonded ADSL2+
Said Ken Haase, vice president of product management at Netopia, “Netopia has always led
the market in the delivery of new broadband gateway technology. We see ADSL2+ bonding taking off, with a noticeable
uptick in carrier requests for gateway solutions to service their new high-performance networks. Basing our Netopia
MiAVo bonded ADSL2+ gateway on the ADI platform is giving us a speed-to-market advantage to establish a leadership
position for ADSL2+ bonded solutions.”
“ADSL2+ bonding lets service providers maximize the
performance of — and investments in — their current access infrastructure to compete in the triple-play arena now,”
said Tony Zarola, strategic business manager for broadband products at Analog Devices. “And the residential CPE is a
vital link in the chain of service delivery.
“Providing a competitive design advantage and
field-proven, standards-compliant ADSL technology to CPE manufacturers like Netopia highlights yet another facet of
ADI’s ongoing commitment to, and leadership role in, shaping the fast-moving broadband market,” Zarola added.
The new ADI ADSL2+ bonding platform was developed in tandem with Aware, Inc. (NASDAQ: AWRE). The
design combines ADI’s Fusiv network processor and two or more EaglePlus ADSL2/2+ PHY devices, based on Aware’s
StratiPHY2+™ and StratiPHY-Bonded™ intellectual property, to achieve bonded link rates of 48Mbps and above. ADI’s
ADSL2+ bonding platform is designed primarily to support ATM layer bonding, and as successfully demonstrated at
SUPERCOMM 2005, has full interoperability with leading DSLAMs (digital subscriber line access multiplexers).
Lunes, 18 Julio, 2005 - 06:00