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Norwood - Analog Devices, Inc. and Netopia, Inc. today announced that Netopia has adopted ADI’s Fusiv™ network processor and new ADSL2+ bonding reference platform as a foundation for Netopia’s MiAVo bonded ADSL2+ gateways.

ADI’s design win is part of the growing adoption of ADSL2+ bonding solutions among carriers and service providers. “Driving faster speeds to the customer is important, but in addition to performance, cost matters for mass-market rollouts. The way that ADSL2+ bonding increases bandwidth while fitting with carriers’ existing copper access connections is what makes it interesting,” said Sam Lucero, industry analyst for Networking at In-Stat.

Netopia’s recently announced MiAVo family of triple-play gateways feature high performance wide area network (WAN) interfaces with innovative new local area network (LAN) distribution technologies for the delivery of triple-play services across fiber, VDSL, and bonded ADSL2+ networks. The new Netopia family of bonded ADSL2+ gateways is ideal for carriers and service providers seeking to deliver triple-play services across their upgraded ADSL2+ bonded networks.

Analog Devices’ ADSL2+ bonding reference design, which includes its high-performance Fusiv and EaglePlus™ technologies, is compliant with the recent ITU-T G.998.1 ( bonding standard. ADSL2+ loop bonding allows carriers to combine two or more existing copper phone lines into a single connection that delivers high-bandwidth access. Carriers and service providers gain the advantage of a quick, low-cost way to reach more subscribers with advanced broadband services such as VoIP, IP television (IPTV), and triple-play bundles of voice, data, and video. The flexibility of ADI’s Fusiv network processing technology enables optimal performance and bill-of-materials (BOM) cost for bonded ADSL2+ CPEs.

Said Ken Haase, vice president of product management at Netopia, “Netopia has always led the market in the delivery of new broadband gateway technology. We see ADSL2+ bonding taking off, with a noticeable uptick in carrier requests for gateway solutions to service their new high-performance networks. Basing our Netopia MiAVo bonded ADSL2+ gateway on the ADI platform is giving us a speed-to-market advantage to establish a leadership position for ADSL2+ bonded solutions.”

“ADSL2+ bonding lets service providers maximize the performance of — and investments in — their current access infrastructure to compete in the triple-play arena now,” said Tony Zarola, strategic business manager for broadband products at Analog Devices. “And the residential CPE is a vital link in the chain of service delivery.

“Providing a competitive design advantage and field-proven, standards-compliant ADSL technology to CPE manufacturers like Netopia highlights yet another facet of ADI’s ongoing commitment to, and leadership role in, shaping the fast-moving broadband market,” Zarola added.

The new ADI ADSL2+ bonding platform was developed in tandem with Aware, Inc. (NASDAQ: AWRE). The design combines ADI’s Fusiv network processor and two or more EaglePlus ADSL2/2+ PHY devices, based on Aware’s StratiPHY2+™ and StratiPHY-Bonded™ intellectual property, to achieve bonded link rates of 48Mbps and above. ADI’s ADSL2+ bonding platform is designed primarily to support ATM layer bonding, and as successfully demonstrated at SUPERCOMM 2005, has full interoperability with leading DSLAMs (digital subscriber line access multiplexers).

Lunes, 18 Julio, 2005 - 06:00
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