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| ANALOG DEVICES’ FUSIV TECHNOLOGY AND ADSL2+ BONDING PLATFORM ENABLE COMTREND RES | |||||
Norwood, - Analog Devices, Inc. today announced that Comtrend Corporation, a leading manufacturer of ADSL and ADSL2+ customer premises equipment (CPE), has standardized on ADI’s Fusiv™ network processor and new ADSL2+bonding reference platform for the Comtrend NexusLink™ Broadband Residential Gateway introduced earlier this year. The NexusLink Residential Gateway combines the benefits of field-proven ADSL2+ technology with standards-compliant loop bonding technology to allow service providers to offer revenue-generating triple-play services including IP television (IPTV). ADSL2+ loop bonding allows carriers to combine two or more existing copper phone lines into a single connection that delivers high-bandwidth access. Service providers gain the advantage of a quick, low-cost way to reach more subscribers with advanced broadband services such as voice over IP (VoIP), IPTV, and triple-play bundles of voice, data, and video. Analog Devices’ ADSL2+ bonding reference design, which includes its high-performance Fusiv and EaglePlus™ technologies, is compliant with the recent ITU-T G.998.1 (G.bond-ATM) bonding standard. The flexibility of ADI’s Fusiv network processing technology enables optimal performance, time to market, and bill-of-materials (BOM) cost for bonded ADSL2+ CPEs. The NexusLink Residential Gateway, Comtrend model number CT-5622, uses ADI’s EaglePlus ADSL2/2+ and Fusiv-Vx 200 chipsets to support multiple users and media devices in a home network or small office environment. The NexusLink Residential Gateway is capable of handling IP video with true traffic management with the use of traffic-specific Virtual Local Area Networks (VLANs). Subscribers can watch television programming while simultaneously sharing a data network for e-mail, audio downloads, and voice on a single device. Internet Group Management Protocol (IGMP) snooping and IGMP proxy provide for proper traffic control of IP multicast packets. Comtrend has successfully completed a full battery of compatibility and interoperability tests with key DSLAM (digital subscriber line access multiplexer) suppliers to assure full performance and ease of installation and provisioning. The new ADI ADSL2+ bonding platform was developed in tandem with Aware, Inc. (NASDAQ: AWRE). The design combines ADI’s Fusiv network processor and two or more EaglePlus ADSL2/2+ PHY devices, based on Aware’s StratiPHY2+™ and StratiPHY-Bonded™ intellectual property, to achieve bonded link rates of 48Mbps and above. ADI’s ADSL2+ bonding platform is designed primarily to support ATM layer bonding, and as successfully demonstrated at SUPERCOMM 2005, has full interoperability with leading DSLAMs. | |||||
Lunes, 18 Julio, 2005 - 06:00 | |||||
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