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RVINE, Calif. and PORTO, Portugal – TransDimension (TDI) announced a strategic partnership to provide the industry’s only complete high-speed USB intellectual property (IP) solution. Combining the strengths and expertise of both companies, the result of the partnership is a complete SoC solution that encompasses Chipidea’s Physical Layer (PHY) IP core and TDI’s High-Speed USB IP core and industry leading software.

As USB becomes a “need to have” feature in most SoCs, system architects and chip designers are faced with a major obstacle: how to get around incompatible IP blocks to design USB into an SoC in a matter of weeks. The partnership between Chipidea and TDI addresses this challenge by offering a single source solution for the three critical components of a successful USB implementation – the PHY, USB controller IP and software.

According to Milton Sousa, Chipidea business development manager, “We are granting our customers a complete solution encompassing the PHY, controller and software that will strongly reduce time to market and minimize risk. Our experience demonstrates that this complete solution can save months of design time and eliminate a great deal of frustration when compared to integrating IP from different sources. Our solution with TDI provides the most complete, integrated solution available in the market.”

All components of this joint solution were developed by Chipidea and TDI, and building on a long product relationship the companies have now extended their relationship to commercially offer a solution that is demonstrated in silicon and has been fully tested for interoperability. “Our complete solution is in use by major OEMs worldwide and has been proven successful in high-volume applications,” said Pete Todd, TDI vice president of sales. “USB implementations are the primary focus for our company - it’s what we do. Other solutions lack the software that is proven to be interoperable with the hardware elements. Through our single source solution we offer the three critical components of a USB implementation that have proven interoperability as well as provide a single support team and a single point of contact through the world-class team at Chipidea.”

The announcement of this partnership comes on the heels of a joint webinar offered by Chipidea and TDI titled, “Simplifying the Integration of High-Speed USB Into Your SoC.” Broadcasted on Wednesday, June 22, the webcast featured experts from Chipidea and TDI and shared insights on the challenges associated with using separate vendors, typical problems faced by SoC manufacturers and the benefits of a single source solution. The companies highlighted a comparison study that explored an IP implementation and demonstrated the benefits realized with a complete, single source solution.

Miércoles, 20 Julio, 2005 - 11:00
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