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| IDT Announces Support for Dual-Core Intel® Xeon®-Based Platforms | |||||
San JOSe, Calif. — IDT™ (Integrated Device Technology, Inc.; NASDAQ: IDTI) today announced its support for the new Intel® Dual-Core Xeon® Processor Series 5000 and 5100 (formerly codenamed “Dempsey” and “Woodcrest”). IDT is providing a suite of platform-optimized devices consisting of an industry-leading advanced memory buffer (AMB) device and a newly available portfolio of high-precision clocking components. With these products, IDT can support the critical timing and interface requirements of the new Intel server platforms. About IDT AMB Technology AMB devices are an essential building block for next-generation, high-bandwidth applications, such as servers, which require increased performance and large memory capacities. A key attribute of the fully-buffered DIMM (FB-DIMM) channel architecture is the high-speed, serial, point-to-point connection between the memory controller and modules on the channel. The AMB chip, located on each FB-DIMM, collects and distributes the data from or to a DIMM, buffers the data internally on the chip and receives or forwards it to the next DIMM or memory controller. This unique channel structure alleviates buffer latency issues common in registered DIMM technology, enabling designers to use a large number of DIMMs within a single system. IDT has established market leadership in AMB technology. In addition to becoming the first AMB vendor to achieve production status, the company was first to sample AMB products and was also first to exhibit system operation. About IDT High-Precision Timing Devices The new Intel server platforms leverage PCI Express® and FB-DIMM technologies to achieve new levels of performance and scalability. To support the platforms’ high-performance capabilities, the new IDT timing devices provide high-precision clocks with a unique combination of low cycle-to-cycle jitter, output-to-output skew and phase jitter characteristics. To address scalability, each device within the portfolio is carefully tuned to maintain the performance attributes as the products are cascaded together. In addition, the products are tailored to meet the needs of each of the multiple timing domains, including low-jitter and spread spectrum. “IDT has strong expertise in server applications and has established leadership in the silicon-based timing solutions market,” said Jimmy Lee, senior vice president and general manager for the IDT Timing Solutions Group. “It is this combination of attributes that makes IDT well suited to meet the overall timing and interface requirements for the new Dual-Core Intel® Xeon®-based platforms. We are pleased to have aligned with Intel to deliver a superior family of devices that enable leading server manufacturers to realize greater performance and scalability.” “The introduction of the Dual-Core Intel® Xeon® processor-based platforms is in line with our goal of offering an integrated, high performance solution, enabling both CIOs and IT managers the ability to improve manageability, IT productivity and performance of servers in the data center, said Jim Pappas, director of initiative marketing for Intel Corporation. “Our proven processor technology and system know-how, coupled with our roster of industry-leading ecosystem vendors, including IDT, will enable us to achieve this goal.” In addition to its AMB and new high-precision timing devices, IDT also offers the PRECISE™ family of PCI Express serial-switching solutions that can be used in conjunction with these platforms to provide high-performance I/O connectivity expansion. All products are available in RoHS-compliant packages. Product Name Part Number Package Type Availability Advanced Memory Device (AMB) AMB0480A5 655-ball flip-chip BGA Device in production High-Precision Timing Device, CK410B Main Clock 932S401, CV126 56-TSSOP/SSOP Device in production High-Precision Timing Device, DB1200G Buffer 9FG1201, CV128 56-TSSOP/SSOP Device in production High-Precision Timing Device, DB1900G 2:17 Buffer 9FG1901, CV145 72-MLF Device in production High-Precision Timing Device, DB1900G 1:18 Buffer 9FG1903 72-MLF Device in production High-Precision Timing Device, DB800v2 Buffer 9DB801C, CV141 48-TSSOP/SSOP Device in production 12-lane, 3-port PCI Express Switch 89PES12N3 324-BGA Device in production 24-lane, 3-port PCI Express Switch 89PES24N3 420-BGA Device in production | |||||
Viernes, 09 Junio, 2006 - 08:54 | |||||
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