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Semiconductor Insights Recognizes Cypress For Most Innovative Image Sensor

SAN JOSE, Calif. and OTTAWA, Canada. - Semiconductor Insights (SI), the leader in technical and patent analyses of integrated circuits and electronic systems, today announced that it has awarded Cypress Semiconductor Corporation's (NYSE: CY) IM103 1/3 inch VGA-Format CMOS Image Sensor for machine vision automotive applications the 2006 INSIGHT Award for Most Innovative Image Sensor.

Acquiring images for display on LCD monitors to show a driver obstacles behind the vehicle, requires very little in terms of either sensor performance or system intelligence," said Dr. Don Scansen, lead technology analyst for image sensors at Semiconductor Insights. "However, Cypress is developing very high performance imaging products that allow the car to decide for itself when a dangerous situation arises. Instead of using an existing image sensor, Cypress created a complete solution for control of wide dynamic range thereby easing implementation for system integrators in machine vision applications."

"We are pleased with Semiconductor Insights' recognition of Cypress's IM103 image sensor for machine vision applications," said Rich Hicks, director of the Automotive Imaging Business Unit for Cypress. "Back up cameras currently account for 90 - 95% of the automotive image sensor market, but machine vision sensors will close the gap as computing power becomes cheaper."

SI's recent analysis of Cypress's IM103 1/3 inch VGA-Format CMOS Image Sensor (part number CYIA2SC0300AA) revealed an 8 x 8 micron pixel with a high maximum sensitivity. "The image sensor has an effective pixel density of 7,100 pixels per square millimeter which is very good for an automotive sensor," said Scansen. "As opposed to regular image sensors, the fill factor depends only on geometry for automotive since microlens materials cannot meet the environmental specifications for automotive applications. We measured the fill factor at 57%, which is an excellent level for a CMOS image sensor that provides a photodiode of more than 36 square microns. The Cypress design team also streamlined the control circuitry to achieve a die efficiency of 47%."

Lunes, 23 Octubre, 2006 - 10:57
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