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AMCC Accelerates Delivery of the Industry’s High-Density CES Offering; End-to-End Converged Network Solution Validated with Zarlink’s CES Access Device

SUNNYVALE, Calif. – Applied Micro Circuits Corp. today announced the results of successful interoperability testing between the company’s Circuit Emulation Services-over-Packet (CES) technology and Zarlink™ Semiconductor’s ZL™ 5011x family of CES access solutions.

The combination of the highest-density CES device on the market from AMCC and Zarlink’s proven CES expertise will uniquely enable system vendors and carriers to build efficient, scalable (up to multiple OC-3 / OC-12) solutions for legacy T1/E1 and revenue-driven applications. The success of this collaboration is attributed to a focus on real-world network measurements and compliance with SAToP and G.8261 standards. As a result, AMCC and Zarlink are able to provide accurate technical results to customers for next-generation system designs.

“By combining our companies’ CES technologies and leveraging AMCC’s long-established networking expertise, we are providing our customers with the best solutions for all of their system design needs,” said Peter Burke, senior vice president and general manager, Network Communications, Zarlink Semiconductor. “The demonstrated interoperability of our technologies gives customers the benefit of a complete converged end-to-end network solution while still using best-in-class components and technologies at each stage.”

AMCC’s CES technology delivers the highest density levels on the market today, representing a multi-generational leap in integration as well as real estate and power savings. AMCC’s CES solution leverages the company’s successful MISSION™ and MISSION™ Access chipsets, as well as AMCC’s expertise and leadership position in the packet processing market. Furthermore, AMCC’s ability to mix CES and MSP data traffic in the same solution (MLPP, PPP, IMA), enables customers to reduce overall system design costs and achieve real convergence of legacy T1/E1s via IP networks.

Collaborative work on these converged network solutions allows customers to easily scale their systems to meet emerging design requirements by utilizing the same core of AMCC hardware and software for OC-3, 2xOC-3, 4xOC-3 and OC-12 data rates. Densities beyond OC-12 can be achieved by adding OC-12 “slices” that require a significantly lower chip count, real estate and power budget, thereby driving down development costs for customers.

“By leveraging our successful MISSION and MISSION Access chipsets, we continue to enable the convergence of data and TDM/voice over the same data connection and support the development of more flexible line cards,” said Sam Fuller, vice president of marketing for AMCC. “Networked systems demand complete solutions that are capable of delivering advanced services while providing backward compatibility for the existing infrastructure. AMCC delivers on all fronts, while supplying the CES industry with the highest density solution on the market.”

Since system-level features have been proven during the testing demonstration, device-interconnect debug is minimized, which translates into overall reduced time-to-market. The validation of AMCC’s SAToP functionality and system configuration provides flexibility for customers to transport CES traffic through AMCC’s platform.

Martes, 12 Diciembre, 2006 - 06:28
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