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ON Semiconductor Introduces Industry’s Smallest ESD Protection Diode Arrays for Portable, Wireless and Computing Applications

PHOENIX, Ariz. – ON Semiconductor, a leading global supplier of efficient power management solutions, today introduced a new series of low-capacitance electrostatic discharge (ESD) protection arrays in an ultra-small SOT-953 package. Measuring 1.0 mm x 1.0 mm with a 0.5 mm profile, these devices are ideal for applications where board space is at a premium. Designed for a wide range of sensitive equipment, these devices are optimized for use in cell phones, PDAs, digital cameras and other protection applications.

These new SOT-953 packaged devices are 60 percent smaller than the SOT-553 ESD protection diode arrays also available from ON Semiconductor. The SOT-953 provides a 30 percent space savings compared to the 1.0 mm x 1.45 mm Micro-QFN - currently the next smallest package available in the market today.

The Devices
The NUP45V6 series offer four independent lines of protection from ESD and other harmful transient voltage events. This new series includes devices with protection voltages of 5.6 volts (V), 6.8 V and 12 V and provide IEC61000 Level 4-2 ESD performance. Because of their miniature size, these diodes can be placed near input/output ports to suppress the transient voltage before it can be coupled into the rest of the board. Delivering low capacitance of less than 7 picofarads (pF) at 3 V, and low leakage current of less than 0.1 micro Amp (µA), these integrated devices are highly efficient and offer reliable protection. The NUP45V6, NUP46V8 and NUP412V are budgetary priced of $0.12 USD in quantities of 10,000.

“By offering innovative board-level solutions like the new ultra-small packaged NUP45V6 series, ON Semiconductor directly addresses the needs of design engineers,” said Hyung-Sup Kim, ON Semiconductor’s marketing director for the Consumer Products Division. “The smaller board space consumption and low profile of the SOT-953 packaging technology, makes the new ESD arrays particularly well suited for next generation slim phones. We plan to continue to expand and adapt our handheld consumer product portfolio with targeted new devices and repackaged existing components. In this way, we can offer a broad range of efficient component solutions housed in highly desirable compact footprints.”

For additional technical information visit, or contact Kelli McNatt at

Jueves, 14 Diciembre, 2006 - 10:45
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