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Agilent Technologies Announces New Automated X-ray Inspection Capabilities with Latest Software Release

SANTA CLARA, Calif., Agilent Technologies Inc. today announced that it has shipped its 8.4 software release with enhanced capabilities for the Medalist 5DX Automated X-ray Inspection (AXI) system.

End-users of the industry-leading 5DX can benefit from the following major AXI enhancements:

* Specialized new algorithm, allowing for inspection of quad-flat no-lead (QFN) with reduced false call rates;
* Defect characterization on non-wetted Direct FET (field-effect transistor) by using an open slope paste test, which was not possible previously; and
* A new threshold that enables end-users to inspect for solder presence along the side edges of a capacitor, in addition to the current capability for inspection at the ends of a capacitor.

"This release brings with it not just bug fixes but real enhancements to the 5DX platform," said Peter Chipman, test manager at NBS Design and a veteran 5DX user. "I have been working with the new QFN algorithm extensively and have caught some defects with this new algorithm family. I am also using the new additions to the paste algorithm family. I think this will be another powerful addition to the 5DX inspection capabilities."

Agilent's 8.4 software release demonstrates the company's continued innovation and commitment to improving X-ray inspection. Agilent is the imaging market leader with its fully automated 3-D X-ray inspection system, and has been in the AXI business for more than 10 years, producing six generations of automated X-ray products.

U.S. Pricing and Availability

Agilent customers on valid support contracts will receive CDs of the 8.4 software free of charge for easy upgrade to their systems. 5DX users with questions can find more information about the 8.4 software for the Medalist 5DX Automated X-ray Inspection system online at

Product photos are available at

About the Agilent Medalist 5DX Automated X-Ray Inspection System

The Agilent Medalist 5DX is an important part of test strategies worldwide. It "sees" through obstructions on crowded printed circuit boards to catch up to 95 percent of all manufacturing defects, including hidden solder-related problems. With no coverage compromise and the ability to achieve low false calls, the 5DX can help manufacturers deliver the highest end quality products with superior reliability. Find out more at

Miércoles, 03 Enero, 2007 - 08:41
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