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Agilent Technologies' New Solder Paste Inspection System Offers Manufacturers Twice the Speed, Enhanced Resolution, Ease of Use

SANTA CLARA, Calif., Agilent Technologies Inc. today introduced a new solder paste inspection system that enables manufacturers of printed circuit board assemblies to slash inspection time in half, without compromising capability.

The system brings industry-leading accuracy and repeatability that has been verified by early adopters, including manufacturers working with 01005 components. Patented imaging techniques coupled with powerful inspection algorithms puts this system far ahead of the competition.

The Agilent Medalist SP50 Series 3 is poised to help manufacturers define the path for solder paste inspection going forward. It demonstrates enhanced ease-of-use and throughput, as well as accuracy and repeatability, all critical factors that help save time and money.

As technology trends and production costs pose new challenges to the industry, it is becoming increasingly important for manufacturers to implement an industry-friendly solder paste inspection system that can provide process feedback and control to help them not only catch defects early, but prevent them from happening in the first place.

"We are committed to help manufacturers meet their latest challenges and needs, and the SP50 Series 3 has the technological capabilities to do that," said Bernadette Duffy, Agilent's marketing manager for automated optical inspection. "Be it a three-month plan to tackle manufacturing needs, or a three-year product roadmap to help our customers grow their inspection capabilities, our dynamic team of experts are geared to help manufacturers keep ahead," she said.

Agilent is demonstrating the new Medalist SP50 Series 3 system at Booth No. 2213 at Apex 2007, Feb. 20 - 22, at the Los Angeles Convention Center, Calif.

Pricing and Availability

The Agilent Medalist SP50 Series 3 is available now. For sales information, contact your local Agilent sales representative, or visit

Product photos are available at

About the Agilent Medalist Automated Optical Inspection (AOI) Family

Both the Medalist SJ50 Component Inspection and SP50 Solder Paste Inspection systems integrate key enabling technologies for a degree of accuracy and flexibility not previously seen in AOI. Interchangeable lighting heads and Agilent's unprecedented unified platform technology allow the systems to be redeployed at paste, pre- or post-solder as needs change. New techniques such as solid shape modeling deliver the highest-resolution 3D images ever achieved in AOI. Seamless links to downstream repair stations and statistical process control tools allow better control over collected data, so your investment can increase line yields and improve processes and board quality.

Miércoles, 17 Enero, 2007 - 11:31
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