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KLA-Tencor Leapfrogs Brightfield Inspection Systems with Industry's first Full-Spectrum Ultra-Broadband Inspection Platform

SAN JOSE, Calif. — To help customers brave the new defect and yield challenges emerging at the 65-nm and 45-nm technology nodes, KLA-Tencor today unveiled the 2800 Series—a breakthrough brightfield wafer inspection platform that enables the widest capture of critical defects across all layers, without compromise. Providing the industry's only ultra-broadband (DUV, UV and visible) wavelength inspection at twice the throughput of previous-generation DUV brightfield imaging tools, the 2800 Series sets new standards in the brightfield inspection arena—enabling chipmakers to meet the full range of inspection requirements needed to accelerate the development and production ramp of their future-generation ICs.

The innovation required to extend performance and conserve power in future-generation ICs is creating a whole new wave of defect challenges. New device structures and materials are creating a wide variety of new defect types and noise sources, while the complexities of new lithography techniques and reticle enhancement strategies are causing a dramatic rise in systematic defects. The sheer magnitude of these defect challenges mandate extremely sensitive and highly flexible inspection solutions capable of detecting the broadest range of defect types in all layers and at multiple nodes. Since different defect types, materials and device layers require different inspection wavelengths for optimal defect detection, full-spectrum ultra-broadband inspection across visible, UV and DUV wavelengths is now a necessity.

KLA-Tencor's new 2800 Series was developed in response to this need, and is the only platform capable of delivering flexible ultra-broadband wavelength coverage to capture the full range of yield-critical defects. In contrast, narrow-band or single-wavelength inspection techniques are severely limited in their ability to capture a range of defect types across multiple device layers, which results in critical defect gaps on multiple device layers.

"Given all the possible material and layer combinations that chipmakers face at the sub-65-nm nodes, tunable-wavelength brightfield inspection should play a critical role in uncovering a wider variety of yield-critical defects," stated Risto Puhakka, president of market research and consulting firm VLSI Research Inc. "KLA-Tencor pioneered the automated brightfield inspection market more than a decade ago with its broadband illumination approach, and has continually refined the technology over the years—amassing considerable applications expertise which has helped leading chipmakers speed yield learning and improve baseline yields. Their latest-generation ultra-broadband brightfield platform, the 2800 Series, should be the next big thing in wafer inspection to help chipmakers ensure optimal yields beyond 65 nm."

Martes, 26 Julio, 2005 - 06:21
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