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Spansion and TSMC Team to Manufacture Innovative Flash Memory Technology

SUNNYVALE and SAN JOSE, Calif. - Spansion LLC and Fujitsu Limited and Taiwan Semiconductor Manufacturing Company announced a manufacturing agreement that will augment Spansion's internal production of its 110 nanometer (nm) MirrorBit™ technology. Pursuant to the agreement, TSMC will supply foundry manufacturing capabilities for Spansion's family of GL, PL and WS wireless products and GL embedded products based on 110nm MirrorBit technology.

TSMC will phase Spansion's 110nm process technologies into its production lines exclusively for use in Spansion's products. Initially, Spansion's 110nm MirrorBit technology will be fabricated on 200mm wafers. The target production ramp date at TSMC is the second quarter of 2006.

"Our partnership with TSMC will help augment our internal production capability and allow us to more quickly migrate to next-generation technologies," Bertrand Cambou, president and CEO of Spansion. "Together, we believe we can create a powerful team to compete in the Flash memory market, one of the fastest growing segments of the semiconductor industry. Our collaboration will also give us additional flexibility in our business model as we continue to meet customer demand for our MirrorBit technology."

"Spansion is a highly innovative company in a growing market," said TSMC CEO Dr. Rick Tsai. "When combined with TSMC's manufacturing muscle and industry-leading customer partnerships, this combination makes for a powerful win-win relationship."

Jueves, 01 Septiembre, 2005 - 10:12
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