|Alguien dijo ...|
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Escritor, poeta y dramaturgo inglés.
|Cadence and UMC Sign Agreement to Streamline Wireless Design|
SAN JOSE, Calif. and HSINCHU, Taiwan - Cadence Design Systems, Inc. and UMC announced a
collaborative agreement to develop a comprehensive reference solution for complex wireless designs. The
jointly-developed reference solution, which will be based on the Cadence Virtuoso custom design platform and targets
UMC's RFCMOS processes, will also include a reference design and other key technology from UMC.
for analog / mixed-signal and RF devices for wireless applications, such as WLAN 802.11, UWB, and Bluetooth, is
driving the need to integrate these various components into a single SoC and accelerate the path to wireless design.
This new collaboration addresses these challenges by combining UMC's RFCMOS process technologies to deliver RF
capabilities and Cadence's analog / mixed-signal and RF design tools and flow integration. The collaboration's
first key milestone -- the verification of the reference design -- has been completed using the Virtuoso
"Aggressive consumer demand for wireless products makes it critical for our customers
to achieve silicon success quickly and meet market demand," said Patrick T. Lin, chief SoC architect at UMC. "By
leveraging Cadence's Virtuoso platform with UMC's advanced manufacturing capabilities, we can provide a
streamlined methodology for the design, simulation and integration of different components into complex SoCs used in
The reference design consists of Digital Baseband Physical Layer Blocks,
Mixed-Mode 1GHz AD/DA converter blocks, RF components, along with several pieces of enabling intellectual property
(IP) from UMC. The companies plan to complete development of the reference flow over the next several months and
then harden the reference design into silicon. Customers will ultimately be able to access a complete wireless
reference design package from UMC. The package will include the reference design, the design flow, compatible
process design kit (PDK) and silicon-validation results from the reference design.
performance and power requirements of today's advanced wireless devices are driving greater functional integration,
leading to sophisticated and integrated SoC solutions," said Jan Willis, senior vice president of Industry Alliances
at Cadence. "Our collaboration with UMC addresses these challenges by providing customers with a comprehensive
technology solution to help shorten their product development time for wireless designs."
Jueves, 06 Octubre, 2005 - 08:41