EL SEGUNDO, Calif. -- International Rectifier, IR® (NYSE: IRF)
today introduced a new DirectFET™ MOSFET synchronous buck converter chip set. The new chip set is suitable for high
frequency, high current DC-DC converters used for next generation Intel® and AMD processors found in high-end
desktops and servers, as well as advanced telecom and datacom systems. For example, in 130A, five-phase converters,
the IRF6619 and IRF6633 chip set delivers 85% efficiency in a compact footprint.
"The new IRF6619 and IRF6633
chip set replaces four standard D-Pak MOSFETs per phase in processor power systems, cutting component count in half
and reducing MOSFET board space by over 50% per phase, enabling a smaller form factor for workstations and servers,"
said Faisal Ahmad, Marketing Manager for DC-DC Computing Products.
The IRF6619, an ideal synchronous
MOSFET, features a very low typical device on-resistance of 1.65 mOhm at 10VGS and 2.2mOhm at 4.5VGS, with a low
reverse recovery charge of 22nC. The IRF6619 is housed in the MX medium can DirectFET package, occupying the same
board area as an SO-8, but with a 0.7mm profile.
IRF6633 is best-suited as a control FET, with very low gate charge and Miller charge of only 4nC, and has more than
43% reduction in on-resistance times gate charge compared to other 20VN devices on the market. The IRF6633
performance figure-of-merit for combined on-state resistance and gate charge is 38 mOhm-nC. The IRF6633 is housed in
the MP medium can DirectFET package, occupying the same board area as SO-8 with only 0.7mm profile.
International Rectifier's patented DirectFET MOSFET packages present a whole new set of design
advantages not previously delivered by standard plastic discrete packages. Their metal can construction enables
dual-side cooling that effectively doubles the current handling capacity of high frequency DC-DC buck converters
powering advanced microprocessors.