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| ANALOG DEVICES HIGHLIGHTS TD-SCDMA TECHNOLOGY ACHIEVEMENTS AT 3G MOBILE INTERNATIONAL SUMMIT & EXHIBITION | |||||
Analog Devices, Inc. today announced that it will be highlighting its innovative 3G cellular technology at the China 3G Mobile International Summit & Exhibition taking place at the China World Hotel in Beijing on June 28 and 29. Taking center stage will be Analog Devices’ SoftFone®-LCR chipset, a flexible, highly integrated solution for developers of 3G mobile terminals based on the TD-SCDMA Low Chip Rate (LCR) air interface, which continues to gain momentum as one of the 3G technologies expected to be implemented in China. The SoftFone-LCR chipset incorporates all the functions necessary to build a TD-SCDMA handset, including the baseband signal processing and control, analog-interface functions and radio, making it the industry’s only complete TD-SCDMA solution from a single silicon supplier. Currently capable of making live TD-SCDMA voice and data calls, the SoftFone-LCR chipset is also featured as the core component in the DTivyTM—A Series reference design from Datang Mobile, the developer of the TD-SCDMA standard. Designed through a collaborate effort between Analog Devices and Datang Mobile, the DTivy—A Series reference design is a complete hardware and software solution providing significant BOM savings and faster time-to-market to manufacturers of next-generation 3G TD-SCDMA products such as high-end camera phones, camcorder phones, multimedia phones, and video phones. Also at the summit, Lining Wang of Analog Devices RF and wireless systems group, will lead a technical presentation on delivering next-generation mobile devices through software and semiconductor innovation. Mr. Wang’s presentation will cover challenges faced by handset designers and highlight technology solutions that incorporate reconfigurable analog functions and software-based radio architectures. The presentation will take place on Wednesday, June 29 at 4:40 p.m. local time. “We are very excited with the industry momentum that is continuing to build around the TD-SCDMA standard as well as our SoftFone-LCR chipset,” said Christian Kermarrec, vice president, RF and wireless systems, Analog Devices, Inc. “Because TD-SCDMA uses unpaired frequency bands and is very efficient in its use of spectrum, we believe that it is a good underlying technology for 3G cellular networks in China.” The China 3G Mobile International Summit & Exhibition is intended to bring together leading mobile operators and service providers, infrastructure providers, chipset suppliers, handset developers, content providers and application developers from China and around the world. Discussions will focus on the hottest issues for China in launching 3G, including policies and regulatory initiatives for the 3G market, case studies and lessons from leading international 3G operator deployments, as well as strategies for developing the market for new 3G mobile services and applications in China. | |||||
Lunes, 04 Julio, 2005 - 06:16 | |||||
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