|Alguien dijo ...|
|La crítica convertida en sistema es la negación del conocimiento y de la verdadera estimación de las cosas.|
Escritor y filósofo suizo.
|ANALOG DEVICES HIGHLIGHTS TD-SCDMA TECHNOLOGY ACHIEVEMENTS AT 3G MOBILE
INTERNATIONAL SUMMIT & EXHIBITION|
Analog Devices, Inc. today announced that it will be
highlighting its innovative 3G cellular technology at the China 3G Mobile International Summit & Exhibition taking
place at the China World Hotel in Beijing on June 28 and 29. Taking center stage will be Analog Devices’
SoftFone®-LCR chipset, a flexible, highly integrated solution for developers of 3G mobile terminals based on the
TD-SCDMA Low Chip Rate (LCR) air interface, which continues to gain momentum as one of the 3G technologies expected
to be implemented in China. The SoftFone-LCR chipset incorporates all the functions necessary to build a TD-SCDMA
handset, including the baseband signal processing and control, analog-interface functions and radio, making it the
industry’s only complete TD-SCDMA solution from a single silicon supplier.
Currently capable of making live
TD-SCDMA voice and data calls, the SoftFone-LCR chipset is also featured as the core component in the DTivyTM—A
Series reference design from Datang Mobile, the developer of the TD-SCDMA standard. Designed through a collaborate
effort between Analog Devices and Datang Mobile, the DTivy—A Series reference design is a complete hardware and
software solution providing significant BOM savings and faster time-to-market to manufacturers of next-generation 3G
TD-SCDMA products such as high-end camera phones, camcorder phones, multimedia phones, and video phones.
Also at the summit, Lining Wang of Analog Devices RF and wireless systems group, will lead a
technical presentation on delivering next-generation mobile devices through software and semiconductor innovation.
Mr. Wang’s presentation will cover challenges faced by handset designers and highlight technology solutions that
incorporate reconfigurable analog functions and software-based radio architectures. The presentation will take place
on Wednesday, June 29 at 4:40 p.m. local time.
“We are very excited with the industry momentum
that is continuing to build around the TD-SCDMA standard as well as our SoftFone-LCR chipset,” said Christian
Kermarrec, vice president, RF and wireless systems, Analog Devices, Inc. “Because TD-SCDMA uses unpaired frequency
bands and is very efficient in its use of spectrum, we believe that it is a good underlying technology for 3G
cellular networks in China.”
The China 3G Mobile International Summit & Exhibition is intended to
bring together leading mobile operators and service providers, infrastructure providers, chipset suppliers, handset
developers, content providers and application developers from China and around the world. Discussions will focus on
the hottest issues for China in launching 3G, including policies and regulatory initiatives for the 3G market, case
studies and lessons from leading international 3G operator deployments, as well as strategies for developing the
market for new 3G mobile services and applications in China.
Lunes, 04 Julio, 2005 - 06:16