©2002 Fairchild Semiconductor Corporation
Rev. A1, December 2002
2N38
19
Epitaxial Silicon Transistor
Absolute Maximum Ratings*
T
C
=25
°
C unless otherwise noted
* This ratings are limiting values above which the serviceability of any semiconductor device may be impaired.
NOTES:
1) These rating are based on a maximum junction temperature of 150 degrees C.
2) These are steady limits. The factory should be consulted on applications involving pulsed or low duty cycle operations.
Electrical Characteristics
T
C
=25
°
C unless otherwise noted
Thermal Characteristics
T
A
=25
°
C unless otherwise noted
* Device mounted on FR-4 PCB 1.5†ť
×
1.6†ť
×
0.06†ť
Symbol
Parameter
Ratings
Units
V
DG
Drain-Gate Voltage
25
V
V
GS
Gate-Source Voltage
-25
V
I
D
Drain Current
50
mA
I
GF
Forward Gate Current
10
mA
T
STG
Storage Temperature Range
-55 ~ 150
°
C
Symbol
Parameter
Test Condition
Min.
Typ.
Max.
Units
Off Characteristics
V
(BR)GSS
Gate-Source Breakdwon Voltage
I
G
= 1.0
µ
A, V
DS
= 0
25
V
I
GSS
Gate Reverse Current
V
GS
= -15V, V
DS
= 0
2.0
nA
V
GS
(off)
Gate-Source Cutoff Voltage
V
DS
= 15V, I
D
= 2.0nA
8.0
V
V
GS
Gate-Source Voltage
V
DS
= 15V, I
D
= 200
µ
A
-0.5
-7.5
V
On Characteristics
I
DSS
Zero-Gate Voltage Drain Current
V
DS
= 15V, V
GS
= 0
2.0
20
mA
Small Signal Characteristics
gfs
Forward Transfer Conductance
V
DS
= 15V, V
GS
= 0, f = 1.0KHz
2000
6500
µ
mhos
goss
Output Conductance
V
DS
= 15V, V
GS
= 0, f = 1.0KHz
50
µ
mhos
y
fs
Forward Transfer Admittance
V
DS
= 15V, V
GS
= 0, f = 1.0KHz
1600
µ
mhos
C
iss
Input Capacitance
V
DS
= 15V, V
GS
= 0, f = 1.0KHz
8.0
pF
C
rss
Reverse Transfer Capacitance
V
DS
= 15V, V
GS
= 0, f = 1.0KHz
4.0
pF
Symbol
Parameter
Max.
Units
P
D
Total Device Dissipation
Derate above 25
°
C
350
2.8
mW
mW/
°
C
R
Θ
JC
Thermal Resistance, Junction to Case
125
°
C/W
R
Θ
JA
Thermal Resistance, Junction to Ambient
357
°
C/W
2N3819
N-Channel RF Amplifier
• This device is designed for RF amplifier and mixer applications
operating up to 450MHz, and for analog switching requiring low
capacitance.
• Sourced from process 50.
TO-92
1. Drain 2. Gate 3. Source
1
0.46
±
0.10
1.27TYP
(R2.29)
3.86MAX
[1.27
±
0.20
]
1.27TYP
[1.27
±
0.20
]
3.60
±
0.20
14.47
±
0.40
1.02
±
0.10
(0.25)
4.58
±
0.20
4.58
+0.25
-0.15
0.38
+0.10
-0.05
0.38
+0.10
-0.05
TO-92
Package Dimensions
2N38
19
Dimensions in Millimeters
©2002 Fairchild Semiconductor Corporation
Rev. A1, December 2002
©2002 Fairchild Semiconductor Corporation
Rev. I1
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not
intended to be an exhaustive list of all such trademarks.
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY
PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY
LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR
CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body,
or (b) support or sustain life, or (c) whose failure to perform
when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to
result in significant injury to the user.
2. A critical component is any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative or In
Design
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
Preliminary
First Production
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
No Identification Needed
Full Production
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
Obsolete
Not In Production
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
FACT™
FACT Quiet series™
FAST
®
FASTr™
FRFET™
GlobalOptoisolator™
GTO™
HiSeC™
I
2
C™
ImpliedDisconnect™
ISOPLANAR™
LittleFET™
MicroFET™
MicroPak™
MICROWIRE™
MSX™
MSXPro™
OCX™
OCXPro™
OPTOLOGIC
®
OPTOPLANAR™
PACMAN™
POP™
Power247™
PowerTrench
®
QFET™
QS™
QT Optoelectronics™
Quiet Series™
RapidConfigure™
RapidConnect™
SILENT SWITCHER
®
SMART START™
SPM™
Stealth™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
SyncFET™
TinyLogic™
TruTranslation™
UHC™
UltraFET
®
VCX™
ACEx™
ActiveArray™
Bottomless™
CoolFET™
CROSSVOLT™
DOME™
EcoSPARK™
E
2
CMOS™
EnSigna™
Across the board. Around the world.™
The Power Franchise™
Programmable Active Droop™