| Secciones |
|---|
| Foros Electrónica |
|
|
| Boletines de correo |
 |
(
)
OUT
ADJ
R
V
V
I
R
2
1.25
1
2
120
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LM137, LM337-N 3-Terminal Adjustable Negative Regulators
1 Features
3 Description
The LM137 and LM337-N are adjustable 3-terminal
1
1.5-A Output Current
negative voltage regulators capable of supplying
Line Regulation 0.01%/V (Typical)
-1.5 A or more currents over an output voltage range
Load Regulation 0.3% (Typical)
of
-1.25 V to -37 V. It requires only two external
resistors to set the output voltage and one output
77-dB Ripple Rejection
capacitor for frequency compensation. The circuit
50 ppm/ C Temperature Coefficient
design has been optimized for excellent regulation
Thermal Overload Protection
and low thermal transients. Further, the LM137 and
LM337-N feature internal current limiting, thermal
Internal Short-Circuit Current Limiting Protections
shutdown and safe-area compensation, making it
virtually blowout-proof against overloads.
2 Applications
The LM137 and LM337-N are ideal complements to
Industrial Power Supplies
the LM117 and LM317 adjustable positive regulators.
Factory Automation Systems
The LM137 has a wider operating temperature range
Building Automation Systems
than the LM337-N and is also offered in military and
PLC Systems
space qualified versions.
Instrumentation
Device
IGBT Drive Negative Gate Supplies
PART NUMBER
PACKAGE
BODY SIZE (NOM)
Networking
LM137
TO (3)
8.255 mm × 8.255 mm
Set-Top Boxes
SOT-223 (4)
3.50 mm × 6.50 mm
LM337-N
TO (3)
8.255 mm × 8.255 mm
TO-220 (3)
10.16 mm × 14.986 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet. The LF01 is a lead formed (bent)
version of the TO-220 package.
Adjustable Negative Voltage Regulator
Full output current not available at high input-output voltages
C1 = 1-
μF solid tantalum or 10-μF aluminum electrolytic required for stability
*C2 = 1-
μF solid tantalum is required only if regulator is more than 4 from power-supply filter capacitor
Output capacitors in the range of 1-
μF to 1000-μF of aluminum or tantalum electrolytic are commonly used to provide
improved output impedance and rejection of transients
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
SNVS778E - MAY 1999 - REVISED JANUARY 2016
Table of Contents
1
Features ..................................................................
8
Application and Implementation ........................
8.1
Application Information............................................
2
Applications ...........................................................
8.2
Typical Applications ................................................
3
Description .............................................................
9
Power Supply Recommendations ......................
4
Revision History.....................................................
10
Layout...................................................................
5
Pin Configuration and Functions .........................
10.1
Layout Guidelines .................................................
6
Specifications.........................................................
10.2
Layout Example ....................................................
6.1
Absolute Maximum Ratings ......................................
10.3
Thermal Considerations ........................................
6.2
ESD Ratings..............................................................
11
Device and Documentation Support .................
6.3
Recommended Operating Conditions .......................
11.1
Documentation Support ........................................
6.4
Thermal Information ..................................................
11.2
Related Links ........................................................
6.5
Electrical Characteristics...........................................
11.3
Community Resources..........................................
6.6
Typical Characteristics ..............................................
11.4
Trademarks ...........................................................
7
Detailed Description ..............................................
11.5
Electrostatic Discharge Caution ............................
7.1
Overview ...................................................................
11.6
Glossary ................................................................
7.2
Functional Block Diagram .........................................
12
Mechanical, Packaging, and Orderable
7.3
Feature Description...................................................
Information ...........................................................
7.4
Device Functional Modes........................................
4 Revision History
Changes from Revision D (April 2013) to Revision E
Page
Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section. .................................................................................................
Deleted soldering information from Absolute Maximum Ratings ...........................................................................................
Changes from Revision C (April 2013) to Revision D
Page
Changed layout of National Data Sheet to TI format .............................................................................................................
2
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5 Pin Configuration and Functions
TO Metal Can Package
TO-220 Plastic Package
3-Pin Package Number NDT0003A
Package Number NDE0003B
Bottom View
Front View
SOT-223
3-Lead Package Marked N02A
Front View
Pin Functions
PIN
I/O
DESCRIPTION
NAME
TO-220
TO
SOT-223
ADJ
1
1
1
Adjust pin
V
IN
2, TAB
3, CASE
2, 4
I
Input voltage pin for the regulator
V
OUT
3
2
3
O
Output voltage pin for the regulator
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6 Specifications
6.1 Absolute Maximum Ratings
MIN
MAX
UNIT
Power dissipation
Internally Limited
Input-output voltage differential
-0.3
40
V
LM137
-55
150
Operating junction temperature
LM337-N
0
125
C
LM337I
-40
125
Storage temperature, T
stg
-65
150
C
6.2 ESD Ratings
VALUE
UNIT
V
(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
2000
V
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Pins listed as 2000
V may actually have higher performance.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
LM137
-55
150
Operating junction temperature
LM337-N
0
125
C
LM337I
-40
125
6.4 Thermal Information
LM137
LM337-N
NDT
NDT
DCY
NDE OR NDG
THERMAL METRIC
(1)
UNIT
(TO)
(TO)
(SOT-223)
(TO-220)
3 PINS
3 PINS
3 PINS
3 PINS
R
ΘJA
Junction-to-ambient thermal resistance
140
(2)
140
(2)
58.3
22.9
C/W
R
ΘJC(top)
Junction-to-case (top) thermal resistance
12
12
36.6
15.7
C/W
R
ΘJB
Junction-to-board thermal resistance
7.2
4.1
C/W
ψ
JT
Junction-to-top characterization parameter
1.3
2.4
C/W
ψ
JB
Junction-to-board characterization parameter
7
4.1
C/W
R
ΘJC(bot)
Junction-to-case (bottom) thermal resistance
1
C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report,
(2)
No heat sink.
4
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6.5 Electrical Characteristics
Unless otherwise specified, these specifications apply
-55 C ≤ T
j
≤ 150 C for the LM137, 0 C ≤ T
j
≤ 125 C for the LM337-N;
V
IN
- V
OUT
= 5 V; and I
OUT
= 0.1 A for the TO package and I
OUT
= 0.5 A for the SOT-223 and TO-220 packages. Although
power dissipation is internally limited, these specifications are applicable for power dissipations of 2 W for the TO and SOT-
223, and 20 W for the TO-220. I
MAX
is 1.5 A for the SOT-223 and TO-220 packages, and 0.2 A for the TO package.
LM137
LM337-N
PARAMETER
TEST CONDITIONS
UNIT
MIN
TYP
MAX
MIN
TYP
MAX
T
J
= 25 C, 3 V
≤ |V
IN
- V
OUT
|
≤ 40 V
(1)
Line regulation
0.01
0.02
0.01
0.04
%/V
I
L
= 10 mA
Load regulation
T
J
= 25 C, 10 mA
≤ I
OUT
≤ I
MAX
0.3%
0.5%
0.3%
1%
Thermal regulation
T
J
= 25 C, 10-ms Pulse
0.002
0.02
0.003
0.04
%/W
Adjustment pin current
65
100
65
100
μA
10 mA
≤ I
L
≤ I
MAX
Adjustment pin current charge
3 V
≤ |V
IN
- V
OUT
|
≤ 40 V,
2
5
2
5
μA
T
A
= 25 C
T
J
= 25 C
(2)
-1.225
-1.25
-1.275
-1.213
-1.25
-1.287
V
3 V
≤ |V
IN
- V
OUT
|
≤ 40 V,
(2)
Reference voltage
10 mA
≤ I
OUT
≤ I
MAX
, P
≤ P
MAX
-55 C ≤ T
J
≤ 150 C
-1.2
-1.25
-1.3
-1.2
-1.25
-1.3
V
Line regulation
3 V
≤ |V
IN
- V
OUT
|
≤ 40 V,
(1)
0.02
0.05
0.02
0.07
%/V
Load regulation
10 mA
≤ I
OUT
≤ I
MAX
,
(1)
0.3%
1%
0.3%
1.5%
Temperature stability
T
MIN
≤ T
j
≤ T
MAX
0.6%
0.6%
|V
IN
- V
OUT
|
≤ 40 V
2.5
5
2.5
10
mA
Minimum load current
|V
IN
- V
OUT
|
≤ 10 V
1.2
3
1.5
6
mA
K, DCY and NDE
1.5
2.2
3.5
1.5
2.2
3.7
A
package
|V
IN
- V
OUT
|
≤ 15 V
NDT package
0.5
0.8
1.8
0.5
0.8
1.9
A
Current limit
K, DCY and NDE
0.24
0.4
0.15
0.4
A
package
|V
IN
- V
OUT
| = 40 V, T
J
= 25 C
NDT package
0.15
0.17
0.1
0.17
A
RMS output noise, % of V
OUT
T
j
= 25 C, 10 Hz
≤ f ≤ 10 kHz
0.003%
0.003%
V
OUT
=
-10 V, f = 120 Hz
60
60
dB
Ripple rejection ratio
C
ADJ
= 10
μF
66
77
66
77
dB
Long-term stability
T
J
= 125 C, 1000 Hours
0.3%
1%
0.3%
1%
(1)
Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output voltage due to
heating effects are covered under the specification for thermal regulation. Load regulation is measured on the output pin at a point
in.
below the base of the TO packages.
(2)
Selected devices with tightened tolerance reference voltage available.
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6.6 Typical Characteristics
(NDE Package)
Figure 2. Current Limit
Figure 1. Load Regulation
Figure 3. Adjustment Current
Figure 4. Dropout Voltage
Figure 5. Temperature Stability
Figure 6. Minimum Operating Current
6
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Typical Characteristics (continued)
(NDE Package)
Figure 7. Ripple Rejection
Figure 8. Ripple Rejection
Figure 9. Ripple Rejection
Figure 10. Output Impedance
Figure 11. Line Transient Response
Figure 12. Load Transient Response
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)
OUT
ADJ
R
V
V
I
R
2
1.25
1
2
120
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ö
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= -
+
+ -
ç
÷
è
ø
SNVS778E - MAY 1999 - REVISED JANUARY 2016
7 Detailed Description
7.1 Overview
In operation, the LM137 and LM337-N develops a nominal
-1.25-V reference voltage between the output and
adjustment terminal. The reference voltage is impressed across program resistor R1 (120
Ω for example) and,
because the voltage is constant, a constant current then flows through the output set resistor R2, giving an
output voltage calculated by
.
(1)
7.2 Functional Block Diagram
7.3 Feature Description
7.3.1 Thermal Regulation
When power is dissipated in an IC, a temperature gradient occurs across the IC chip affecting the individual IC
circuit components. With an IC regulator, this gradient can be especially severe because power dissipation is
large. Thermal regulation is the effect of these temperature gradients on output voltage (in percentage output
change) per Watt of power change in a specified time. Thermal regulation error is independent of electrical
regulation or temperature coefficient, and occurs within 5 ms to 50 ms after a change in power dissipation.
Thermal regulation depends on IC layout as well as electrical design. The thermal regulation of a voltage
regulator is defined as the percentage change of V
OUT
, per Watt, within the first 10 ms after a step of power is
applied. The LM137 device's specification is 0.02%/W, maximum.
8
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Feature Description (continued)
LM137
V
OUT
=
-10 V
V
IN
- V
OUT
=
-40 V
I
IL
= 0 A
0.25 A 0 A
Vertical sensitivity, 5 mV/div
Figure 13. Output Drift (10W Pulse for 10ms)
In
a typical LM137 device's output drifts only 3 mV (or 0.03% of V
OUT
=
-10 V) when a 10-W pulse is
applied for 10 ms. This performance is thus well inside the specification limit of 0.02%/W × 10 W = 0.2%
maximum. When the 10-W pulse is ended, the thermal regulation again shows a 3-mV step at the LM137 chip
cools off.
NOTE
The load regulation error of about 8 mV (0.08%) is additional to the thermal regulation
error.
In
, when the 10-W pulse is applied for 100 ms, the output drifts only slightly beyond the drift in the first
10 ms, and the thermal error stays well within 0.1% (10 mV).
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Feature Description (continued)
LM137
V
OUT
=
-10 V
V
IN
- V
OUT
=
-40 V
I
L
= 0 A
0.25 A 0 A
Horizontal sensitivity, 20 ms/div
Figure 14. Output Drift (10-W Pulse for 100 ms)
7.4 Device Functional Modes
7.4.1 Protection Diodes
When external capacitors are used with any IC regulator, it is sometimes necessary to add protection diodes to
prevent the capacitors from discharging through low current points into the regulator. Most 10-
μF capacitors have
low enough internal series resistance to deliver 20-A spikes when shorted. Although the surge is short, there is
enough energy to damage parts of the IC.
When an output capacitor is connected to a negative output regulator and the input is shorted, the output
capacitor pulls current out of the output of the regulator. The current depends on the value of the capacitor, the
output voltage of the regulator, and the rate at which V
IN
is shorted to ground.
The bypass capacitor on the adjustment terminal can discharge through a low current junction. Discharge occurs
when either the input, or the output, is shorted.
shows the placement of the protection diodes.
10
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Device Functional Modes (continued)
*When C
L
is larger than 20
μF, D1 protects the LM137 in case the input supply is shorted
**When C2 is larger than 10
μF and -V
OUT
is larger than
-25V, D2 protects the LM137 in case the output is shorted
Figure 15. Regulator With Protection Diodes
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)
OUT
ADJ
R
V
V
I
R
2
1.25
1
2
120
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÷
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TIs customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The LM137 and LM337-N are versatile, high performance, negative output linear regulators with high accuracy
and a wide temperature range. An output capacitor can be added to further improve transient response, and the
ADJ pin can be bypassed to achieve very high ripple-rejection ratios. The device's functionality can be utilized in
many different applications that require negative voltage supplies, such as bipolar amplifiers, operational
amplifiers, and constant current regulators.
8.2 Typical Applications
8.2.1 Adjustable Negative Voltage Regulator
The LM137 and LM337-N can be used as a simple, negative output regulator to enable a variety of output
voltages needed for demanding applications. By using an adjustable R2 resistor, a variety of negative output
voltages can be made possible as shown in
Full output current not available at high input-output voltages
C1 = 1-
μF solid tantalum or 10-μF aluminum electrolytic required for stability
*C2 = 1-
μF solid tantalum is required only if regulator is more than 4 inches from power-supply filter capacitor
Output capacitors in the range of 1
μF to 1000 μF of aluminum or tantalum electrolytic are commonly used to provide
improved output impedance and rejection of transients
Figure 16. Adjustable Negative Voltage Regulator
(2)
8.2.1.1 Design Requirements
The device component count is very minimal, employing two resistors as part of a voltage divider circuit and an
output capacitor for load regulation. An input capacitor is needed if the device is more than 4 inches from the
filter capacitors.
8.2.1.2 Detailed Design Procedure
The output voltage is set based on the selection of the two resistors, R1 and R2, as shown in
.
12
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Typical Applications (continued)
8.2.1.3 Application Curve
As shown in
, the maximum output current capability is limited by the input-output voltage differential,
package type, and junction temperature.
Figure 17. Current Limit
8.2.2 Adjustable Lab Voltage Regulator
The LM337-N can be combined with a positive regulator such as the LM317-N to provide both a positive and
negative voltage rail. This can be useful in applications that use bi-directional amplifiers and dual-supply
operational amplifiers.
Full output current not available at high input-output voltages
*The 10
μF capacitors are optional to improve ripple rejection
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*0.8
R1
120
W
W
OUT
1.250V
I
=
R1
SNVS778E - MAY 1999 - REVISED JANUARY 2016
Typical Applications (continued)
8.2.3 Current Regulator
A simple, fixed current regulator can be made by placing a resistor between the V
OUT
and ADJ pins of the
LM137. By regulating a constant 1.25 V between these two terminals, a constant current can be delivered.
(3)
(4)
8.2.4
-5.2-V Regulator with Electronic Shutdown
The LM337-N can be used with a PNP transistor to provide shutdown control from a TTL control signal. The PNP
can short or open the ADJ pin to GND. When ADJ is shorted to GND by the PNP, the output is
-1.3V. When
ADJ is disconnected from GND by the PNP, then the LM337-N outputs the programmed output of
-5.2 V.
Minimum output
-1.3 V when control input is low
14
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Typical Applications (continued)
8.2.5 High Stability
-10-V Regulator
Using a high stability shunt voltage reference in the feedback path, such as the LM329, provides damping
necessary for a stable, low noise output.
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9 Power Supply Recommendations
The input supply to the LM137 and LM337-N must be kept at a voltage level such that its maximum input to
output differential voltage rating is not exceeded. The minimum dropout voltage must also be met with extra
headroom when possible to keep the LM137 and LM337-N in regulation. TI recommends an input capacitor,
especially when the input pin is placed more than 4 inches away from the power-supply filter capacitor.
10 Layout
10.1 Layout Guidelines
Some layout guidelines must be followed to ensure proper regulation of the output voltage with minimum noise.
Traces carrying the load current must be wide to reduce the amount of parasitic trace inductance and the
feedback loop from V
OUT
to ADJ must be kept as short as possible. To improve PSRR, a bypass capacitor can
be placed at the ADJ pin and must be placed as close as possible to the IC. In cases when V
IN
shorts to ground,
an external diode must be placed from V
IN
to V
OUT
to divert the surge current into the output capacitor and
protect the IC. Similarly, in cases when a large bypass capacitor is placed at the ADJ pin and V
OUT
shorts to
ground, an external diode must be placed from V
OUT
to ADJ to provide a path for the bypass capacitor to
discharge. These diodes must be placed close to the corresponding IC pins to increase their effectiveness.
10.2 Layout Example
Figure 18. Layout Example (SOT-223)
16
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10.3 Thermal Considerations
10.3.1 Heatsinking SOT-223 Package Parts
The SOT-223 DCY packages use a copper plane on the PCB and the PCB itself as a heatsink. To optimize the
heat sinking ability of the plane and PCB, solder the tab of the package to the plane.
and
show the information for the SOT-223 package.
assumes a
Θ
(J
-A)
of 75 C/W
for 1 ounce copper and 51 C/W for 2 ounce copper and a maximum junction temperature of 125 C.
Figure 19.
Θ
(J
-A)
vs Copper (2 ounce) Area for the SOT-223 Package
Figure 20. Maximum Power Dissipation vs T
AMB
for the SOT-223 Package
See AN-1028,
for power enhancement techniques to be used with the SOT-223 package.
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11 Device and Documentation Support
11.1 Documentation Support
11.1.1 Related Documentation
For related documentation see the following:
AN-1028,
11.2 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 1. Related Links
TECHNICAL
TOOLS &
SUPPORT &
PARTS
PRODUCT FOLDER
SAMPLE & BUY
DOCUMENTS
SOFTWARE
COMMUNITY
LM137
LM337-N
11.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's
TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.6 Glossary
TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
18
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20-Jul-2016
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp ( C)
Device Marking
(4/5)
Samples
LM137H
ACTIVE
TO
NDT
3
500
Green (RoHS
& no Sb/Br)
Call TI
Level-1-NA-UNLIM
-55 to 150
( LM137HP+ ~
LM137HP+)
LM137H/NOPB
ACTIVE
TO
NDT
3
500
Green (RoHS
& no Sb/Br)
Call TI
Level-1-NA-UNLIM
-55 to 150
( LM137HP+ ~
LM137HP+)
LM137KG-MW8
ACTIVE
WAFERSALE
YS
0
1
Green (RoHS
& no Sb/Br)
Call TI
Level-1-NA-UNLIM
LM337H
ACTIVE
TO
NDT
3
500
Green (RoHS
& no Sb/Br)
Call TI
Level-1-NA-UNLIM
0 to 125
( LM337H ~ LM337H)
LM337H/NOPB
ACTIVE
TO
NDT
3
500
Green (RoHS
& no Sb/Br)
Call TI
Level-1-NA-UNLIM
0 to 125
( LM337H ~ LM337H)
LM337IMP
NRND
SOT-223
DCY
4
1000
TBD
Call TI
Call TI
-40 to 125
N02A
LM337IMP/NOPB
ACTIVE
SOT-223
DCY
4
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
N02A
LM337IMPX
NRND
SOT-223
DCY
4
2000
TBD
Call TI
Call TI
-40 to 125
N02A
LM337IMPX/NOPB
ACTIVE
SOT-223
DCY
4
2000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
N02A
LM337T
NRND
TO-220
NDE
3
45
TBD
Call TI
Call TI
0 to 125
LM337T P+
LM337T/LF01
ACTIVE
TO-220
NDG
3
45
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
0 to 125
LM337T P+
LM337T/NOPB
ACTIVE
TO-220
NDE
3
45
Pb-Free (RoHS
Exempt)
CU SN
Level-1-NA-UNLIM
0 to125
LM337T P+
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
PACKAGE OPTION ADDENDUM
www.ti.com
20-Jul-2016
Addendum-Page 2
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package
Type
Package
Drawing
Pins
SPQ
Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
LM337IMP
SOT-223
DCY
4
1000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LM337IMP/NOPB
SOT-223
DCY
4
1000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LM337IMPX
SOT-223
DCY
4
2000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LM337IMPX/NOPB
SOT-223
DCY
4
2000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Jun-2015
Pack Materials-Page 1
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM337IMP
SOT-223
DCY
4
1000
367.0
367.0
35.0
LM337IMP/NOPB
SOT-223
DCY
4
1000
367.0
367.0
35.0
LM337IMPX
SOT-223
DCY
4
2000
367.0
367.0
35.0
LM337IMPX/NOPB
SOT-223
DCY
4
2000
367.0
367.0
35.0
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Jun-2015
Pack Materials-Page 2
MECHANICAL DATA
NDT0003A
www.ti.com
H03A (Rev D)
MECHANICAL DATA
NDE0003B
www.ti.com
MECHANICAL DATA
NDG0003F
www.ti.com
T03F (Rev B)
MECHANICAL DATA
MPDS094A - APRIL 2001 - REVISED JUNE 2002
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
DCY (R-PDSO-G4)
PLASTIC SMALL-OUTLINE
4202506/B 06/2002
6,30 (0.248)
6,70 (0.264)
2,90 (0.114)
3,10 (0.122)
6,70 (0.264)
7,30 (0.287)
3,70 (0.146)
3,30 (0.130)
0,02 (0.0008)
0,10 (0.0040)
1,50 (0.059)
1,70 (0.067)
0,23 (0.009)
0,35 (0.014)
1
2
3
4
0,66 (0.026)
0,84 (0.033)
1,80 (0.071) MAX
Seating Plane
0
-10
Gauge Plane
0,75 (0.030) MIN
0,25 (0.010)
0,08 (0.003)
0,10 (0.004) M
2,30 (0.091)
4,60 (0.181)
M
0,10 (0.004)
NOTES: A. All linear dimensions are in millimeters (inches).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion.
D. Falls within JEDEC TO-261 Variation AA.
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changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
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TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TIs terms
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