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LM35
+V
S
R1
V
OUT
tV
S
LM35
+V
S
(4 V to 20 V)
OUTPUT
0 mV + 10.0 mV/ °C
SNIS159F - AUGUST 1999 - REVISED JANUARY 2016
LM35 Precision Centigrade Temperature Sensors
1 Features
3 Description
The LM35 series are precision integrated-circuit
1
•
Calibrated Directly in Celsius (Centigrade)
temperature devices with an output voltage linearly-
•
Linear + 10-mV/ °C Scale Factor
proportional to the Centigrade temperature. The
•
0.5 °C Ensured Accuracy (at 25 °C)
LM35
device
has
an
advantage
over
linear
temperature sensors calibrated in Kelvin, as the user
•
Rated for Full
-55 °C to 150 °C Range
is not required to subtract a large constant voltage
•
Suitable for Remote Applications
from the output to obtain convenient Centigrade
•
Low-Cost Due to Wafer-Level Trimming
scaling. The LM35 device does not require any
external calibration or trimming to provide typical
•
Operates from 4 V to 30 V
accuracies of ± Ľ °C at room temperature and ± ľ °C
•
Less than 60-
μA Current Drain
over a full
-55 °C to 150 °C temperature range. Lower
•
Low Self-Heating, 0.08 °C in Still Air
cost is assured by trimming and calibration at the
•
Non-Linearity Only ± Ľ °C Typical
wafer level. The low-output impedance, linear output,
and precise inherent calibration of the LM35 device
•
Low-Impedance Output, 0.1
Ω for 1-mA Load
makes interfacing to readout or control circuitry
especially easy. The device is used with single power
2 Applications
supplies, or with plus and minus supplies. As the
•
Power Supplies
LM35 device draws only 60
μA from the supply, it has
very low self-heating of less than 0.1 °C in still air. The
•
Battery Management
LM35 device is rated to operate over a
-55 °C to
•
HVAC
150 °C temperature range, while the LM35C device is
•
Appliances
rated for a
-40 °C to 110 °C range (-10 ° with
improved accuracy). The LM35-series devices are
available
packaged
in
hermetic
TO
transistor
packages, while the LM35C, LM35CA, and LM35D
devices are available in the plastic TO-92 transistor
package. The LM35D device is available in an 8-lead
surface-mount small-outline package and a plastic
TO-220 package.
Device
PART NUMBER
PACKAGE
BODY SIZE (NOM)
TO-CAN (3)
4.699 mm × 4.699 mm
TO-92 (3)
4.30 mm × 4.30 mm
LM35
SOIC (8)
4.90 mm × 3.91 mm
TO-220 (3)
14.986 mm × 10.16 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
Basic Centigrade Temperature Sensor
Full-Range Centigrade Temperature Sensor
(2 °C to 150 °C)
Choose R
1
= -V
S
/ 50 µA
V
OUT
= 1500 mV at 150 °C
V
OUT
= 250 mV at 25 °C
V
OUT
= -550 mV at -55 °C
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
SNIS159F - AUGUST 1999 - REVISED JANUARY 2016
Table of Contents
7.2
Functional Block Diagram .......................................
1
Features ..................................................................
7.3
Feature Description.................................................
2
Applications ...........................................................
7.4
Device Functional Modes........................................
3
Description .............................................................
8
Application and Implementation ........................
4
Revision History.....................................................
8.1
Application Information............................................
5
Pin Configuration and Functions .........................
8.2
Typical Application ..................................................
6
Specifications.........................................................
8.3
System Examples ...................................................
6.1
Absolute Maximum Ratings ......................................
9
Power Supply Recommendations ......................
6.2
ESD Ratings..............................................................
10
Layout...................................................................
6.3
Recommended Operating Conditions .......................
10.1
Layout Guidelines .................................................
6.4
Thermal Information ..................................................
10.2
Layout Example ....................................................
6.5
Electrical Characteristics: LM35A, LM35CA Limits...
11
Device and Documentation Support .................
6.6
Electrical Characteristics: LM35A, LM35CA .............
11.1
Trademarks ...........................................................
6.7
Electrical Characteristics: LM35, LM35C, LM35D
Limits..........................................................................
11.2
Electrostatic Discharge Caution ............................
6.8
Electrical Characteristics: LM35, LM35C, LM35D ...
11.3
Glossary ................................................................
6.9
Typical Characteristics ............................................
12
Mechanical, Packaging, and Orderable
Information ...........................................................
7
Detailed Description ............................................
7.1
Overview .................................................................
4 Revision History
Changes from Revision E (January 2015) to Revision F
Page
•
Changed NDV Package (TO-CAN) pinout from Top View to Bottom View ...........................................................................
Changes from Revision D (October 2013) to Revision E
Page
•
Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional
Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section ..............................
Changes from Revision C (July 2013) to Revision D
Page
•
Changed W to Ω ....................................................................................................................................................................
•
Changed W to Ω in Abs Max tablenote. ................................................................................................................................
2
Copyright © 1999-2016, Texas Instruments Incorporated
Product Folder Links:
+V
S
V
OUT
GND
+V
S
V
OUT
GND
N.C.
N.C.
N.C.
N.C.
N.C.
1
2
3
4
8
7
6
5
+V
S
V
OUT
GND
LM
35DT
+V
S
V
OUT
GND
t
SNIS159F - AUGUST 1999 - REVISED JANUARY 2016
5 Pin Configuration and Functions
NDV Package
NEB Package
3-Pin TO-CAN
3-Pin TO-220
(Bottom View)
(Top View)
Case is connected to negative pin (GND)
D Package
8-PIN SOIC
(Top View)
Tab is connected to the negative pin
(GND).
NOTE: The LM35DT pinout is different than
N.C. = No connection
the discontinued LM35DP
LP Package
3-Pin TO-92
(Bottom View)
Pin Functions
PIN
TYPE
DESCRIPTION
NAME
TO46
TO92
TO220
SO8
V
OUT
—
—
—
1
O
Temperature Sensor Analog Output
—
—
—
2
N.C.
—
No Connection
—
—
—
3
Device ground pin, connect to power supply negative
GND
—
—
—
4
GROUND
terminal
—
—
—
5
N.C.
—
—
—
6
—
No Connection
—
—
—
7
+V
S
—
—
—
8
POWER
Positive power supply pin
Copyright © 1999-2016, Texas Instruments Incorporated
3
Product Folder Links:
SNIS159F - AUGUST 1999 - REVISED JANUARY 2016
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1) (2)
MIN
MAX
UNIT
Supply voltage
-0.2
35
V
Output voltage
-1
6
V
Output current
10
mA
Maximum Junction Temperature, T
J
max
150
°C
TO-CAN, TO-92 Package
-60
150
Storage Temperature, T
stg
°C
TO-220, SOIC Package
-65
150
(1)
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(2)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not
apply when operating the device beyond its rated operating conditions.
6.2 ESD Ratings
VALUE
UNIT
V
(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
±2500
V
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
LM35, LM35A
-55
150
Specified operating temperature: T
MIN
to
LM35C, LM35CA
-40
110
°C
T
MAX
LM35D
0
100
Supply Voltage (+V
S
)
4
30
V
6.4 Thermal Information
LM35
THERMAL METRIC
(1) (2)
NDV
LP
D
NEB
UNIT
3 PINS
8 PINS
3 PINS
R
ΘJA
Junction-to-ambient thermal resistance
400
180
220
90
°C/W
R
ΘJC(top)
Junction-to-case (top) thermal resistance
24
—
—
—
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report,
(2)
For additional thermal resistance information, see
4
Copyright © 1999-2016, Texas Instruments Incorporated
Product Folder Links:
SNIS159F - AUGUST 1999 - REVISED JANUARY 2016
6.5 Electrical Characteristics: LM35A, LM35CA Limits
Unless otherwise noted, these specifications apply:
-55 °C ≤ T
J
≤ 150 °C for the LM35 and LM35A; -40 °C ≤ T
J
≤ 110 °C for the
LM35C and LM35CA; and 0 °C
≤ T
J
≤ 100 °C for the LM35D. V
S
= 5 Vdc and I
LOAD
= 50
μA, in the circuit of
. These specifications also apply from 2 °C to T
MAX
in the circuit of
LM35A
LM35CA
PARAMETER
TEST CONDITIONS
UNIT
TYP
TESTED
DESIGN
TYP
TESTED
DESIGN
LIMIT
(1)
LIMIT
(2)
LIMIT
(1)
LIMIT
(2)
T
A
= 25 °C
±0.2
±0.5
±0.2
±0.5
T
A
= -10 °C
±0.3
±0.3
±1
Accuracy
(3)
°C
T
A
= T
MAX
±0.4
±1
±0.4
±1
T
A
= T
MIN
±0.4
±1
±0.4
±1.5
T
MIN
≤ T
A
≤ T
MAX
,
Nonlinearity
(4)
±0.18
±0.35
±0.15
±0.3
°C
-40 °C
≤ T
J
≤ 125 °C
T
MIN
≤ T
A
≤ T
MAX
10
9.9
10
9.9
Sensor gain
mV/ °C
(average slope)
-40 °C
≤ T
J
≤ 125 °C
10
10.1
10
10.1
T
A
= 25 °C
±0.4
±1
±0.4
±1
Load regulation
(5)
mV/mA
T
MIN
≤ T
A
≤ T
MAX
,
0
≤ I
L
≤ 1 mA
±0.5
±3
±0.5
±3
-40 °C
≤ T
J
≤ 125 °C
T
A
= 25 °C
±0.01
±0.05
±0.01
±0.05
Line regulation
(5)
mV/V
4 V
≤ V
S
≤ 30 V,
±0.02
±0.1
±0.02
±0.1
-40 °C
≤ T
J
≤ 125 °C
V
S
= 5 V, 25 °C
56
67
56
67
V
S
= 5 V, -40 °C
≤ T
J
≤ 125 °C
105
131
91
114
Quiescent current
(6)
µA
V
S
= 30 V, 25 °C
56.2
68
56.2
68
V
S
= 30 V, -40 °C
≤ T
J
≤ 125 °C
105.5
133
91.5
116
4 V
≤ V
S
≤ 30 V, 25 °C
0.2
1
0.2
1
Change of quiescent
µA
4 V
≤ V
S
≤ 30 V,
current
(5)
0.5
2
0.5
2
-40 °C
≤ T
J
≤ 125 °C
Temperature
coefficient of
-40 °C
≤ T
J
≤ 125 °C
0.39
0.5
0.39
0.5
µA/ °C
quiescent current
Minimum temperature
In circuit of
I
L
= 0
1.5
2
1.5
2
°C
for rate accuracy
Long term stability
T
J
= T
MAX
, for 1000 hours
±0.08
±0.08
°C
(1)
Tested Limits are ensured and 100% tested in production.
(2)
Design Limits are ensured (but not 100% production tested) over the indicated temperature and supply voltage ranges. These limits are
not used to calculate outgoing quality levels.
(3)
Accuracy is defined as the error between the output voltage and 10 mv/ °C times the case temperature of the device, at specified
conditions of voltage, current, and temperature (expressed in °C).
(4)
Non-linearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line, over the rated
temperature range of the device.
(5)
Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating
effects can be computed by multiplying the internal dissipation by the thermal resistance.
(6)
Quiescent current is defined in the circuit of
.
Copyright © 1999-2016, Texas Instruments Incorporated
5
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SNIS159F - AUGUST 1999 - REVISED JANUARY 2016
6.6 Electrical Characteristics: LM35A, LM35CA
Unless otherwise noted, these specifications apply:
-55 °C ≤ T
J
≤ 150 °C for the LM35 and LM35A; -40 °C ≤ T
J
≤ 110 °C for the
LM35C and LM35CA; and 0 °C
≤ T
J
≤ 100 °C for the LM35D. V
S
= 5 Vdc and I
LOAD
= 50
μA, in the circuit of
. These specifications also apply from 2 °C to T
MAX
in the circuit of
LM35A
LM35CA
PARAMETER
TEST CONDITIONS
UNIT
MIN
TYP
MAX
TYP
TYP
MAX
±0.2
±0.2
T
A
= 25 °C
Tested Limit
(2)
±0.5
±0.5
Design Limit
(3)
±0.3
±0.3
T
A
= -10 °C
Tested Limit
(2)
Design Limit
(3)
±1
Accuracy
(1)
°C
±0.4
±0.4
T
A
= T
MAX
Tested Limit
(2)
±1
±1
Design Limit
(3)
±0.4
±0.4
T
A
= T
MIN
Tested Limit
(2)
±1
Design Limit
(3)
±1.5
±0.18
±0.15
T
MIN
≤ T
A
≤ T
MAX
,
Nonlinearity
(4)
Tested Limit
(2)
°C
-40 °C
≤ T
J
≤ 125 °C
Design Limit
(3)
±0.35
±0.3
10
10
T
MIN
≤ T
A
≤ T
MAX
Tested Limit
(2)
9.9
Design Limit
(3)
9.9
Sensor gain
mV/ °C
(average slope)
10
10
-40 °C
≤ T
J
≤ 125 °C
Tested Limit
(2)
10.1
Design Limit
(3)
10.1
±0.4
±0.4
T
A
= 25 °C
Tested Limit
(2)
±1
±1
Design Limit
(3)
Load regulation
(5)
mV/mA
0
≤ I
L
≤ 1 mA
±0.5
±0.5
T
MIN
≤ T
A
≤ T
MAX
,
Tested Limit
(2)
-40 °C
≤ T
J
≤ 125 °C
Design Limit
(3)
±3
±3
±0.01
±0.01
T
A
= 25 °C
Tested Limit
(2)
±0.05
±0.05
Design Limit
(3)
Line regulation
(5)
mV/V
±0.02
±0.02
4 V
≤ V
S
≤ 30 V,
Tested Limit
(2)
-40 °C
≤ T
J
≤ 125 °C
Design Limit
(3)
±0.1
±0.1
(1)
Accuracy is defined as the error between the output voltage and 10 mv/ °C times the case temperature of the device, at specified
conditions of voltage, current, and temperature (expressed in °C).
(2)
Tested Limits are ensured and 100% tested in production.
(3)
Design Limits are ensured (but not 100% production tested) over the indicated temperature and supply voltage ranges. These limits are
not used to calculate outgoing quality levels.
(4)
Non-linearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line, over the rated
temperature range of the device.
(5)
Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating
effects can be computed by multiplying the internal dissipation by the thermal resistance.
6
Copyright © 1999-2016, Texas Instruments Incorporated
Product Folder Links:
SNIS159F - AUGUST 1999 - REVISED JANUARY 2016
Electrical Characteristics: LM35A, LM35CA (continued)
Unless otherwise noted, these specifications apply:
-55 °C ≤ T
J
≤ 150 °C for the LM35 and LM35A; -40 °C ≤ T
J
≤ 110 °C for the
LM35C and LM35CA; and 0 °C
≤ T
J
≤ 100 °C for the LM35D. V
S
= 5 Vdc and I
LOAD
= 50
μA, in the circuit of
. These specifications also apply from 2 °C to T
MAX
in the circuit of
LM35A
LM35CA
PARAMETER
TEST CONDITIONS
UNIT
MIN
TYP
MAX
TYP
TYP
MAX
56
56
V
S
= 5 V, 25 °C
Tested Limit
(2)
67
67
Design Limit
(3)
105
91
V
S
= 5 V,
Tested Limit
(2)
-40 °C
≤ T
J
≤ 125 °C
Design Limit
(3)
131
114
Quiescent
µA
current
(6)
56.2
56.2
V
S
= 30 V, 25 °C
Tested Limit
(2)
68
68
Design Limit
(3)
105.5
91.5
V
S
= 30 V,
Tested Limit
(2)
-40 °C
≤ T
J
≤ 125 °C
Design Limit
(3)
133
116
0.2
0.2
4 V
≤ V
S
≤ 30 V, 25 °C
Tested Limit
(2)
1
1
Change of
Design Limit
(3)
quiescent
µA
0.5
0.5
current
(5)
4 V
≤ V
S
≤ 30 V,
Tested Limit
(2)
-40 °C
≤ T
J
≤ 125 °C
Design Limit
(3)
2
2
0.39
0.39
Temperature
coefficient of
-40 °C
≤ T
J
≤ 125 °C
Tested Limit
(2)
µA/ °C
quiescent current
Design Limit
(3)
0.5
0.5
1.5
1.5
Minimum
In circuit of
, I
L
=
temperature for
Tested Limit
(2)
°C
0
rate accuracy
Design Limit
(3)
2
2
Long term
±0.08
±0.08
T
J
= T
MAX
, for 1000 hours
°C
stability
(6)
Quiescent current is defined in the circuit of
.
Copyright © 1999-2016, Texas Instruments Incorporated
7
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6.7 Electrical Characteristics: LM35, LM35C, LM35D Limits
Unless otherwise noted, these specifications apply:
-55 °C ≤ T
J
≤ 150 °C for the LM35 and LM35A; -40 °C ≤ T
J
≤ 110 °C for the
LM35C and LM35CA; and 0 °C
≤ T
J
≤ 100 °C for the LM35D. V
S
= 5 Vdc and I
LOAD
= 50
μA, in the circuit of
. These specifications also apply from 2 °C to T
MAX
in the circuit of
LM35
LM35C, LM35D
PARAMETER
TEST CONDITIONS
UNIT
TYP
TESTED
DESIGN
TYP
TESTED
DESIGN
LIMIT
(1)
LIMIT
(2)
LIMIT
(1)
LIMIT
(2)
T
A
= 25 °C
±0.4
±1
±0.4
±1
T
A
= -10 °C
±0.5
±0.5
±1.5
Accuracy, LM35,
°C
LM35C
(3)
T
A
= T
MAX
±0.8
±1.5
±0.8
±1.5
T
A
= T
MIN
±0.8
±1.5
±0.8
±2
T
A
= 25 °C
±0.6
±1.5
Accuracy, LM35D
(3)
T
A
= T
MAX
±0.9
±2
°C
T
A
= T
MIN
±0.9
±2
T
MIN
≤ T
A
≤ T
MAX
,
Nonlinearity
(4)
±0.3
±0.5
±0.2
±0.5
°C
-40 °C
≤ T
J
≤ 125 °C
T
MIN
≤ T
A
≤ T
MAX
,
10
9.8
10
9.8
Sensor gain
-40 °C
≤ T
J
≤ 125 °C
mV/ °C
(average slope)
10
10.2
10
10.2
T
A
= 25 °C
±0.4
±2
±0.4
±2
Load regulation
(5)
mV/mA
T
MIN
≤ T
A
≤ T
MAX
,
0
≤ I
L
≤ 1 mA
±0.5
±5
±0.5
±5
-40 °C
≤ T
J
≤ 125 °C
T
A
= 25 °C
±0.01
±0.1
±0.01
±0.1
Line regulation
(5)
mV/V
4 V
≤ V
S
≤ 30 V,
±0.02
±0.2
±0.02
±0.2
-40 °C
≤ T
J
≤ 125 °C
V
S
= 5 V, 25 °C
56
80
56
80
V
S
= 5 V, -40 °C
≤ T
J
≤ 125 °C
105
158
91
138
Quiescent current
(6)
µA
V
S
= 30 V, 25 °C
56.2
82
56.2
82
V
S
= 30 V, -40 °C
≤ T
J
≤ 125 °C
105.5
161
91.5
141
4 V
≤ V
S
≤ 30 V, 25 °C
0.2
2
0.2
2
Change of quiescent
µA
4 V
≤ V
S
≤ 30 V,
current
(5)
0.5
3
0.5
3
-40 °C
≤ T
J
≤ 125 °C
Temperature
coefficient of
-40 °C
≤ T
J
≤ 125 °C
0.39
0.7
0.39
0.7
µA/ °C
quiescent current
Minimum temperature
In circuit of
I
L
= 0
1.5
2
1.5
2
°C
for rate accuracy
Long term stability
T
J
= T
MAX
, for 1000 hours
±0.08
±0.08
°C
(1)
Tested Limits are ensured and 100% tested in production.
(2)
Design Limits are ensured (but not 100% production tested) over the indicated temperature and supply voltage ranges. These limits are
not used to calculate outgoing quality levels.
(3)
Accuracy is defined as the error between the output voltage and 10 mv/ °C times the case temperature of the device, at specified
conditions of voltage, current, and temperature (expressed in °C).
(4)
Non-linearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line, over the rated
temperature range of the device.
(5)
Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating
effects can be computed by multiplying the internal dissipation by the thermal resistance.
(6)
Quiescent current is defined in the circuit of
.
8
Copyright © 1999-2016, Texas Instruments Incorporated
Product Folder Links:
SNIS159F - AUGUST 1999 - REVISED JANUARY 2016
6.8 Electrical Characteristics: LM35, LM35C, LM35D
Unless otherwise noted, these specifications apply:
-55 °C ≤ T
J
≤ 150 °C for the LM35 and LM35A; -40 °C ≤ T
J
≤ 110 °C for the
LM35C and LM35CA; and 0 °C
≤ T
J
≤ 100 °C for the LM35D. V
S
= 5 Vdc and I
LOAD
= 50
μA, in the circuit of
. These specifications also apply from 2 °C to T
MAX
in the circuit of
LM35
LM35C, LM35D
PARAMETER
TEST CONDITIONS
UNIT
MIN
TYP
MAX
MIN
TYP
MAX
±0.4
±0.4
T
A
= 25 °C
Tested Limit
(2)
±1
±1
Design Limit
(3)
±0.5
±0.5
T
A
= -10 °C
Tested Limit
(2)
Design Limit
(3)
±1.5
Accuracy, LM35,
°C
LM35C
(1)
±0.8
±0.8
T
A
= T
MAX
Tested Limit
(2)
±1.5
Design Limit
(3)
±1.5
±0.8
±0.8
T
A
= T
MIN
Tested Limit
(2)
Design Limit
(3)
±1.5
±2
±0.6
T
A
= 25 °C
Tested Limit
(2)
±1.5
Design Limit
(3)
±0.9
Accuracy,
T
A
= T
MAX
Tested Limit
(2)
°C
LM35D
(1)
Design Limit
(3)
±2
±0.9
T
A
= T
MIN
Tested Limit
(2)
Design Limit
(3)
±2
±0.3
±0.2
T
MIN
≤ T
A
≤ T
MAX
,
Nonlinearity
(4)
Tested Limit
(2)
°C
-40 °C
≤ T
J
≤ 125 °C
Design Limit
(3)
±0.5
±0.5
10
10
T
MIN
≤ T
A
≤ T
MAX
,
Tested Limit
(2)
9.8
-40 °C
≤ T
J
≤ 125 °C
Design Limit
(3)
9.8
Sensor gain
mV/ °C
(average slope)
10
10
Tested Limit
(2)
10.2
Design Limit
(3)
10.2
±0.4
±0.4
T
A
= 25 °C
Tested Limit
(2)
±2
±2
Design Limit
(3)
Load regulation
(5)
mV/mA
0
≤ I
L
≤ 1 mA
±0.5
±0.5
T
MIN
≤ T
A
≤ T
MAX
,
Tested Limit
(2)
-40 °C
≤ T
J
≤ 125 °C
Design Limit
(3)
±5
±5
(1)
Accuracy is defined as the error between the output voltage and 10 mv/ °C times the case temperature of the device, at specified
conditions of voltage, current, and temperature (expressed in °C).
(2)
Tested Limits are ensured and 100% tested in production.
(3)
Design Limits are ensured (but not 100% production tested) over the indicated temperature and supply voltage ranges. These limits are
not used to calculate outgoing quality levels.
(4)
Non-linearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line, over the rated
temperature range of the device.
(5)
Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating
effects can be computed by multiplying the internal dissipation by the thermal resistance.
Copyright © 1999-2016, Texas Instruments Incorporated
9
Product Folder Links:
SNIS159F - AUGUST 1999 - REVISED JANUARY 2016
Electrical Characteristics: LM35, LM35C, LM35D (continued)
Unless otherwise noted, these specifications apply:
-55 °C ≤ T
J
≤ 150 °C for the LM35 and LM35A; -40 °C ≤ T
J
≤ 110 °C for the
LM35C and LM35CA; and 0 °C
≤ T
J
≤ 100 °C for the LM35D. V
S
= 5 Vdc and I
LOAD
= 50
μA, in the circuit of
. These specifications also apply from 2 °C to T
MAX
in the circuit of
LM35
LM35C, LM35D
PARAMETER
TEST CONDITIONS
UNIT
MIN
TYP
MAX
MIN
TYP
MAX
±0.01
±0.01
T
A
= 25 °C
Tested Limit
(2)
±0.1
Design Limit
(3)
±0.1
Line regulation
(5)
mV/V
±0.02
±0.02
4 V
≤ V
S
≤ 30 V,
Tested Limit
(2)
-40 °C
≤ T
J
≤ 125 °C
Design Limit
(3)
±0.2
±0.2
56
56
V
S
= 5 V, 25 °C
Tested Limit
(2)
80
80
Design Limit
(3)
105
91
V
S
= 5 V, -40 °C
≤ T
J
≤
Tested Limit
(2)
125 °C
Design Limit
(3)
158
138
Quiescent
µA
current
(6)
56.2
56.2
V
S
= 30 V, 25 °C
Tested Limit
(2)
82
82
Design Limit
(3)
105.5
91.5
V
S
= 30 V,
Tested Limit
(2)
-40 °C
≤ T
J
≤ 125 °C
Design Limit
(3)
161
141
0.2
0.2
4 V
≤ V
S
≤ 30 V, 25 °C
Tested Limit
(2)
2
Change of
Design Limit
(3)
2
quiescent
µA
0.5
0.5
current
(5)
4 V
≤ V
S
≤ 30 V,
Tested Limit
(2)
-40 °C
≤ T
J
≤ 125 °C
Design Limit
(3)
3
3
0.39
0.39
Temperature
coefficient of
-40 °C
≤ T
J
≤ 125 °C
Tested Limit
(2)
µA/ °C
quiescent current
Design Limit
(3)
0.7
0.7
1.5
1.5
Minimum
temperature for
In circuit of
, I
L
= 0 Tested Limit
(2)
°C
rate accuracy
Design Limit
(3)
2
2
Long term
±0.08
±0.08
T
J
= T
MAX
, for 1000 hours
°C
stability
(6)
Quiescent current is defined in the circuit of
.
10
Copyright © 1999-2016, Texas Instruments Incorporated
Product Folder Links:
0
20
40
60
80
100
120
140
160
±
75
±
25
25
75
125
175
QUI
E
S
CE
NT
CU
RR
E
NT
(
A
)
TEMPERATURE (
Ć’
C)
C006
2.4
2.6
2.8
3.0
3.2
3.4
3.6
3.8
4.0
4.2
4.4
±
75
±
25
25
75
125
175
S
UP
P
L
Y
V
OL
T
A
GE
(
V
)
TEMPERATURE (
Ć’
C)
C005
TYPICAL
I
OUT
= 2.0 mA
TYPICAL
I
OUT
= 1.0 mA
TYPICAL
I
OUT
= 0 A or 50 A
±
20
0
20
40
60
80
100
120
0
2
4
6
8
P
E
RC
E
NT
O
F
F
INA
L
V
A
L
UE
(
%
)
TIME (MINUTES)
C003
±
20
0
20
40
60
80
100
120
0
2
4
6
8
P
E
RC
E
NT
O
F
F
INA
L
V
A
L
UE
(
%
)
TIME (SEC)
C004
T0-46
T0-92
0
100
200
300
400
0
400
800
1200
1600
2000
T
HE
RM
A
L
RE
S
IS
T
A
NC
E
(
Ć’
C/W
)
AIR VELOCITY (FPM)
C001
T0-46
T0-92
0
5
10
15
20
25
30
35
40
45
0
400
800
1200
1600
2000
T
IM
E
CONS
T
A
NT
(
S
E
C)
AIR VELOCITY (FPM)
C002
T0-46
T0-92
SNIS159F - AUGUST 1999 - REVISED JANUARY 2016
6.9 Typical Characteristics
Figure 1. Thermal Resistance Junction To Air
Figure 2. Thermal Time Constant
Figure 3. Thermal Response In Still Air
Figure 4. Thermal Response In Stirred Oil Bath
Figure 5. Minimum Supply Voltage vs Temperature
Figure 6. Quiescent Current vs Temperature (in Circuit of
)
Copyright © 1999-2016, Texas Instruments Incorporated
11
Product Folder Links:
-20 -10
0
10
20
30
40
50
60
-0.2
0
0.2
0.4
0.6
0
2
4
6
TIME ( SEC)
C011
V
O
U
T
(
V
)
V
IN
(
V
)
±
2.5
±
2.0
±
1.5
±
1.0
±
0.5
0.0
0.5
1.0
1.5
2.0
2.5
±
75
±
25
25
75
125
175
T
E
M
P
E
RA
T
UR
E
E
RR
OR
(
Ć’
C
)
TEMPERATURE (
Ć’
C)
C009
LM35C
LM35CA
LM35D
LM35C
TYPICAL
LM35CA
10
100
1k
10k
100k
0
200
400
600
800
1000
1200
1400
1600
Noise
(
n
V
/
—
Hz
)
FREQUENCY (Hz)
C010
40
60
80
100
120
140
160
180
200
±
75
±
25
25
75
125
175
QUI
E
S
CE
NT
CU
RR
E
NT
(
A
)
TEMPERATURE (
Ć’
C)
C007
±
2.0
±
1.5
±
1.0
±
0.5
0.0
0.5
1.0
1.5
2.0
±
75
±
25
25
75
125
175
T
E
M
P
E
RA
T
UR
E
E
RR
OR
(
Ć’
C
)
TEMPERATURE (
Ć’
C)
C008
LM35
LM35A
LM35
LM35A
TYPICAL
SNIS159F - AUGUST 1999 - REVISED JANUARY 2016
Typical Characteristics (continued)
Figure 7. Quiescent Current vs Temperature (in Circuit of
Figure 8. Accuracy vs Temperature (Ensured)
)
Figure 10. Noise Voltage
Figure 9. Accuracy vs Temperature (Ensured)
Figure 11. Start-Up Response
12
Copyright © 1999-2016, Texas Instruments Incorporated
Product Folder Links:
.125 R2
V
OUT
= 10 mV/ °C
+
+V
S
R2
A2
A1
V
0
nR1
i
8.8 mV/ °C
nR1
Q1
Q2
10E
E
1.38 V
PTAT
SNIS159F - AUGUST 1999 - REVISED JANUARY 2016
7 Detailed Description
7.1 Overview
The LM35-series devices are precision integrated-circuit temperature sensors, with an output voltage linearly
proportional to the Centigrade temperature. The LM35 device has an advantage over linear temperature sensors
calibrated in Kelvin, as the user is not required to subtract a large constant voltage from the output to obtain
convenient Centigrade scaling. The LM35 device does not require any external calibration or trimming to provide
typical accuracies of ± Ľ °C at room temperature and ± ľ °C over a full
-55 °C to 150 °C temperature range.
Lower cost is assured by trimming and calibration at the wafer level. The low output impedance, linear output,
and precise inherent calibration of the LM35 device makes interfacing to readout or control circuitry especially
easy. The device is used with single power supplies, or with plus and minus supplies. As the LM35 device draws
only 60
μA from the supply, it has very low self-heating of less than 0.1 °C in still air. The LM35 device is rated to
operate over a
-55 °C to 150 °C temperature range, while the LM35C device is rated for a -40 °C to 110 °C range
(
-10 ° with improved accuracy). The temperature-sensing element is comprised of a delta-V BE architecture.
The temperature-sensing element is then buffered by an amplifier and provided to the VOUT pin. The amplifier
has a simple class A output stage with typical 0.5-
Ω output impedance as shown in the
Therefore the LM35 can only source current and it's sinking capability is limited to 1
μA.
7.2 Functional Block Diagram
7.3 Feature Description
7.3.1 LM35 Transfer Function
The accuracy specifications of the LM35 are given with respect to a simple linear transfer function:
V
OUT
= 10 mv/ °F × T
where
•
V
OUT
is the LM35 output voltage
•
T is the temperature in °C
(1)
7.4 Device Functional Modes
The only functional mode of the LM35 is that it has an analog output directly proportional to temperature.
Copyright © 1999-2016, Texas Instruments Incorporated
13
Product Folder Links:
LM35
+
OUT
HEAVY CAPACITIVE LOAD, WIRING, ETC.
TO A HIGH-IMPEDANCE LOAD
v
75
1
P
F
0.01
P
F BYPASS
OPTONAL
LM35
+
OUT
2 k
HEAVY CAPACITIVE LOAD, WIRING, ETC.
TO A HIGH-IMPEDANCE LOAD
v
SNIS159F - AUGUST 1999 - REVISED JANUARY 2016
8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The features of the LM35 make it suitable for many general temperature sensing applications. Multiple package
options expand on it's flexibility.
8.1.1 Capacitive Drive Capability
Like most micropower circuits, the LM35 device has a limited ability to drive heavy capacitive loads. Alone, the
LM35 device is able to drive 50 pF without special precautions. If heavier loads are anticipated, isolating or
decoupling the load with a resistor is easy (see
The tolerance of capacitance can be improved with a
series R-C damper from output to ground (see
).
When the LM35 device is applied with a 200-
Ω load resistor as shown in
,
, or
the
device is relatively immune to wiring capacitance because the capacitance forms a bypass from ground to input
and not on the output. However, as with any linear circuit connected to wires in a hostile environment,
performance is affected adversely by intense electromagnetic sources (such as relays, radio transmitters, motors
with arcing brushes, and SCR transients), because the wiring acts as a receiving antenna and the internal
junctions act as rectifiers. For best results in such cases, a bypass capacitor from V
IN
to ground and a series R-C
damper, such as 75
Ω in series with 0.2 or 1 μF from output to ground, are often useful. Examples are shown in
and
Figure 12. LM35 with Decoupling from Capacitive Load
Figure 13. LM35 with R-C Damper
14
Copyright © 1999-2016, Texas Instruments Incorporated
Product Folder Links:
±
2.0
±
1.5
±
1.0
±
0.5
0.0
0.5
1.0
1.5
2.0
±
75
±
25
25
75
125
175
T
E
M
P
E
RA
T
UR
E
E
RR
OR
(
Ć’
C
)
TEMPERATURE (
Ć’
C)
C008
LM35
LM35A
LM35
LM35A
TYPICAL
LM35
+V
S
(4 V to 20 V)
OUTPUT
0 mV + 10.0 mV/ °C
SNIS159F - AUGUST 1999 - REVISED JANUARY 2016
8.2 Typical Application
8.2.1 Basic Centigrade Temperature Sensor
Figure 14. Basic Centigrade Temperature Sensor (2 °C to 150 °C)
8.2.1.1 Design Requirements
Table 1. Design Parameters
PARAMETER
VALUE
Accuracy at 25 °C
±0.5 °C
Accuracy from -55 °C to 150 °C
±1 °C
Temperature Slope
10 mV/ °C
8.2.1.2 Detailed Design Procedure
Because the LM35 device is a simple temperature sensor that provides an analog output, design requirements
related to layout are more important than electrical requirements. For a detailed description, refer to the
.
8.2.1.3 Application Curve
Figure 15. Accuracy vs Temperature (Ensured)
Copyright © 1999-2016, Texas Instruments Incorporated
15
Product Folder Links:
+V
S
LM35
18 k
10%
V
OUT
+
v
1N914
LM35
+
OUT
V
OUT
= 10 mV/ °C (T
AMBIENT
= 10 °C)
FROM t 5 °C TO + 40 °C
5 V
200
1%
200
1%
TWISTED PAIR
0.01
P
F
BYPASS
OPTIONAL
2 k
1%
2 k
1%
LM35
+
OUT
V
OUT
= 10 mV/ °C (T
AMBIENT
= 1 °C)
FROM + 2 °C TO + 40 °C
v
5 V
200
1%
6.8 k
5%
200
1%
TWISTED PAIR
HEAT
FINS
+
v
LM35
+
OUT
V
OUT
= 10 mV/ °C (T
AMBIENT
= 1 °C)
FROM + 2 °C TO + 40 °C
v
5 V
200
1%
6.8 k
5%
OR 10K RHEOSTAT
FOR GAIN ADJUST
200
1%
TWISTED PAIR
HEAT
FINS
SNIS159F - AUGUST 1999 - REVISED JANUARY 2016
8.3 System Examples
Figure 16. Two-Wire Remote Temperature Sensor
Figure 17. Two-Wire Remote Temperature Sensor
(Grounded Sensor)
(Output Referred to Ground)
Figure 18. Temperature Sensor, Single Supply
Figure 19. Two-Wire Remote Temperature Sensor
(
-55 ° to +150 °C)
(Output Referred to Ground)
16
Copyright © 1999-2016, Texas Instruments Incorporated
Product Folder Links:
LM35
9 V
1 k
25.5 k
LM385-
2.5
100 A,
60 mV
FULL-
SCALE
LM35
5 V
LM35
+V
S
(6 V to 20 V)
45.5 kO
1%
10 kO
1%
26.4 kO
1%
1 MO
1%
18 kO
LM385-1.2
V
OUT
= +1 mV/ °F
LM35
LM317
402
1%
50
OUT
OFFSET
ADJUST
+
v
OUT
62.5
0.5%
4.7 k
IN
ADJ
+ 5 V TO + 30 V
2N2907
SNIS159F - AUGUST 1999 - REVISED JANUARY 2016
System Examples (continued)
Figure 20. 4-To-20 mA Current Source
Figure 21. Fahrenheit Thermometer
(0 °C to 100 °C)
Figure 22. Centigrade Thermometer
Figure 23. Fahrenheit Thermometer, Expanded
Scale Thermometer
(Analog Meter)
(50 °F to 80 °F, for Example Shown)
Copyright © 1999-2016, Texas Instruments Incorporated
17
Product Folder Links:
LM35
+
OUT
200*
1.5 k*
HEAT
FINS
V
A
R
A
1 k
1
P
F
+
20
P
F
+
LM3914
LM3914
1.2 k*
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
10
20 k
18
1
2
3
7 V
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
NC
V
B
V
C
499*
499*
10
18
7 V
7 V
1.5 k*
R
C
1 k
1 k*
R
B
1 k
20 LEDs
°F
LM35
LM131
47
+
GND
8
6 V
100 k
0.01
P
F
100 k
1
P
F
12 k
5 k
FULL
SCALE
ADJ
1
2
4
6
7
0.01
P
F
LOW TEMPCO
3
5
1 k
6.8 k
4N28
f
OUT
LM35
+
OUT
GND
75
1
P
F
16 k
ADC0804
+
2 k
1 k
+
IN
V
REF
0.64 V
5 V
8
PARALLEL
DATA
OUTPUT
INTR
CS
RD
WR
GND
LM35
+
OUT
GND
75
1
P
F
3.9 k
+
10 k
100k
+
IN
5 V
SERIAL
DATA OUTPUT
CLOCK
ENABLE
GND
ADC08031
LM385
FB
REF
1.28 V
SNIS159F - AUGUST 1999 - REVISED JANUARY 2016
System Examples (continued)
Figure 24. Temperature to Digital Converter
Figure 25. Temperature to Digital Converter
(Serial Output)
(Parallel TRI-STATE Outputs for Standard Data Bus
to
μP Interface)
(128 °C Full Scale)
(128 °C Full Scale)
*=1% or 2% film resistor
Trim R
B
for V
B
= 3.075 V
Trim R
C
for V
C
= 1.955 V
Trim R
A
for V
A
= 0.075 V + 100 mV/ °C ×T
ambient
Example, V
A
= 2.275 V at 22 °C
Figure 26. Bar-Graph Temperature Display
Figure 27. LM35 With Voltage-To-Frequency
Converter and Isolated Output
(Dot Mode)
(2 °C to 150 °C; 20 to 1500 Hz)
18
Copyright © 1999-2016, Texas Instruments Incorporated
Product Folder Links:
SNIS159F - AUGUST 1999 - REVISED JANUARY 2016
9 Power Supply Recommendations
The LM35 device has a very wide 4-V to 5.5-V power supply voltage range, which makes it ideal for many
applications. In noisy environments, TI recommends adding a 0.1
μF from V+ to GND to bypass the power
supply voltage. Larger capacitances maybe required and are dependent on the power-supply noise.
10 Layout
10.1 Layout Guidelines
The LM35 is easily applied in the same way as other integrated-circuit temperature sensors. Glue or cement the
device to a surface and the temperature should be within about 0.01 °C of the surface temperature.
The 0.01 °C proximity presumes that the ambient air temperature is almost the same as the surface temperature.
If the air temperature were much higher or lower than the surface temperature, the actual temperature of the
LM35 die would be at an intermediate temperature between the surface temperature and the air temperature;
this is especially true for the TO-92 plastic package. The copper leads in the TO-92 package are the principal
thermal path to carry heat into the device, so its temperature might be closer to the air temperature than to the
surface temperature.
Ensure that the wiring leaving the LM35 device is held at the same temperature as the surface of interest to
minimize the temperature problem. The easiest fix is to cover up these wires with a bead of epoxy. The epoxy
bead will ensure that the leads and wires are all at the same temperature as the surface, and that the
temperature of the LM35 die is not affected by the air temperature.
The TO-46 metal package can also be soldered to a metal surface or pipe without damage. Of course, in that
case the V
- terminal of the circuit will be grounded to that metal. Alternatively, mount the LM35 inside a sealed-
end metal tube, and then dip into a bath or screw into a threaded hole in a tank. As with any IC, the LM35 device
and accompanying wiring and circuits must be kept insulated and dry, to avoid leakage and corrosion. This is
especially true if the circuit may operate at cold temperatures where condensation can occur. Printed-circuit
coatings and varnishes such as a conformal coating and epoxy paints or dips are often used to insure that
moisture cannot corrode the LM35 device or its connections.
These devices are sometimes soldered to a small light-weight heat fin to decrease the thermal time constant and
speed up the response in slowly-moving air. On the other hand, a small thermal mass may be added to the
sensor, to give the steadiest reading despite small deviations in the air temperature.
Table 2. Temperature Rise of LM35 Due To Self-heating (Thermal Resistance, R
ΘJA
)
SOIC-8
(2)
,
TO, no heat
TO
(1)
, small
TO-92, no heat
TO-92
(2)
, small
SOIC-8, no
TO-220, no
small heat
sink
heat fin
sink
heat fin
heat sink
heat sink
fin
Still air
400 °C/W
100 °C/W
180 °C/W
140 °C/W
220 °C/W
110 °C/W
90 °C/W
Moving air
100 °C/W
40 °C/W
90 °C/W
70 °C/W
105 °C/W
90 °C/W
26 °C/W
Still oil
100 °C/W
40 °C/W
90 °C/W
70 °C/W
—
—
—
Stirred oil
50 °C/W
30 °C/W
45 °C/W
40 °C/W
—
—
—
(Clamped to
metal, Infinite
(24 °C/W)
—
—
(55 °C/W)
—
heat sink)
(1)
Wakefield type 201, or 1-in disc of 0.02-in sheet brass, soldered to case, or similar.
(2)
TO-92 and SOIC-8 packages glued and leads soldered to 1-in square of 1/16-in printed circuit board with 2-oz foil or similar.
Copyright © 1999-2016, Texas Instruments Incorporated
19
Product Folder Links:
V
OUT
N.C.
N.C.
+V
S
N.C.
0.01 µF
VIA to ground plane
VIA to power plane
GND
N.C.
N.C.
SNIS159F - AUGUST 1999 - REVISED JANUARY 2016
10.2 Layout Example
Figure 28. Layout Example
20
Copyright © 1999-2016, Texas Instruments Incorporated
Product Folder Links:
SNIS159F - AUGUST 1999 - REVISED JANUARY 2016
11 Device and Documentation Support
11.1 Trademarks
All trademarks are the property of their respective owners.
11.2 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.3 Glossary
— TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 1999-2016, Texas Instruments Incorporated
21
Product Folder Links:
PACKAGE OPTION ADDENDUM
www.ti.com
27-Feb-2016
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp ( °C)
Device Marking
(4/5)
Samples
LM35AH
ACTIVE
TO
NDV
3
500
TBD
Call TI
Call TI
-55 to 150
( LM35AH ~ LM35AH)
LM35AH/NOPB
ACTIVE
TO
NDV
3
500
Green (RoHS
& no Sb/Br)
Call TI
Level-1-NA-UNLIM
-55 to 150
( LM35AH ~ LM35AH)
LM35CAH
ACTIVE
TO
NDV
3
500
TBD
Call TI
Call TI
-40 to 110
( LM35CAH ~
LM35CAH)
LM35CAH/NOPB
ACTIVE
TO
NDV
3
500
Green (RoHS
& no Sb/Br)
Call TI
Level-1-NA-UNLIM
-40 to 110
( LM35CAH ~
LM35CAH)
LM35CAZ/LFT4
ACTIVE
TO-92
LP
3
2000
Green (RoHS
& no Sb/Br)
CU SN
N / A for Pkg Type
LM35
CAZ
LM35CAZ/NOPB
ACTIVE
TO-92
LP
3
1800
Green (RoHS
& no Sb/Br)
CU SN
N / A for Pkg Type
-40 to 110
LM35
CAZ
LM35CH
ACTIVE
TO
NDV
3
500
TBD
Call TI
Call TI
-40 to 110
( LM35CH ~ LM35CH)
LM35CH/NOPB
ACTIVE
TO
NDV
3
500
Green (RoHS
& no Sb/Br)
Call TI
Level-1-NA-UNLIM
-40 to 110
( LM35CH ~ LM35CH)
LM35CZ/LFT1
ACTIVE
TO-92
LP
3
2000
Green (RoHS
& no Sb/Br)
CU SN
N / A for Pkg Type
LM35
CZ
LM35CZ/NOPB
ACTIVE
TO-92
LP
3
1800
Green (RoHS
& no Sb/Br)
CU SN
N / A for Pkg Type
-40 to 110
LM35
CZ
LM35DH
ACTIVE
TO
NDV
3
1000
TBD
Call TI
Call TI
0 to 70
( LM35DH ~ LM35DH)
LM35DH/NOPB
ACTIVE
TO
NDV
3
1000
Green (RoHS
& no Sb/Br)
Call TI | POST-PLATE
Level-1-NA-UNLIM
0 to 70
( LM35DH ~ LM35DH)
LM35DM
NRND
SOIC
D
8
95
TBD
Call TI
Call TI
0 to 100
LM35D
M
LM35DM/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
0 to 100
LM35D
M
LM35DMX
NRND
SOIC
D
8
2500
TBD
Call TI
Call TI
0 to 100
LM35D
M
LM35DMX/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
0 to 100
LM35D
M
LM35DT
NRND
TO-220
NEB
3
45
TBD
Call TI
Call TI
0 to 100
LM35DT
LM35DT/NOPB
ACTIVE
TO-220
NEB
3
45
Green (RoHS
& no Sb/Br)
CU SN
Level-1-NA-UNLIM
0 to 100
LM35DT
PACKAGE OPTION ADDENDUM
www.ti.com
27-Feb-2016
Addendum-Page 2
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp ( °C)
Device Marking
(4/5)
Samples
LM35DZ
OBSOLETE
TO-92
LP
3
TBD
Call TI
Call TI
LM35DZ/LFT1
ACTIVE
TO-92
LP
3
2000
Green (RoHS
& no Sb/Br)
CU SN
N / A for Pkg Type
LM35
DZ
LM35DZ/LFT4
ACTIVE
TO-92
LP
3
2000
Green (RoHS
& no Sb/Br)
CU SN
N / A for Pkg Type
LM35
DZ
LM35DZ/NOPB
ACTIVE
TO-92
LP
3
1800
Green (RoHS
& no Sb/Br)
CU SN
N / A for Pkg Type
0 to 100
LM35
DZ
LM35H
ACTIVE
TO
NDV
3
500
TBD
Call TI
Call TI
-55 to 150
( LM35H ~ LM35H)
LM35H/NOPB
ACTIVE
TO
NDV
3
500
Green (RoHS
& no Sb/Br)
Call TI
Level-1-NA-UNLIM
-55 to 150
( LM35H ~ LM35H)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
PACKAGE OPTION ADDENDUM
www.ti.com
27-Feb-2016
Addendum-Page 3
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package
Type
Package
Drawing
Pins
SPQ
Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
LM35DMX
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LM35DMX/NOPB
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Jan-2016
Pack Materials-Page 1
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM35DMX
SOIC
D
8
2500
367.0
367.0
35.0
LM35DMX/NOPB
SOIC
D
8
2500
367.0
367.0
35.0
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Jan-2016
Pack Materials-Page 2
MECHANICAL DATA
NDV0003H
www.ti.com
H03H (Rev F)
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TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
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